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TYWE3SE Datasheet

1. Product Overview

TYWE3SE is a low-power embedded 2.4 GHz Wi-Fi and Bluetooth module that Tuya has

developed. It consists of a highly integrated RF chip (ESP32) and several peripheral

components, with an embedded Wi-Fi network protocol stack and robust library functions.

TYWE3SE is embedded with a low-power 32-bit CPU, 4 MB flash memory, 448 KB read

only memory (ROM), and 520 KB static random-access memory (SRAM), and has

extensive peripherals. TYWE3SE is an RTOS platform that integrates all function libraries

of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth

products as required.

1.1 Features

 Embedded low-power 32-bit CPU, which can also function as an application

processor

 Dominant frequency: 160 MHz

 Working voltage: 3.0 V to 3.6 V

 Peripherals: 14 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1

analog-to-digital converter (ADC)

 Wi-Fi connectivity

 802.11b/g/n

 2.4 GHz Wi-fi

 WPA and WPA2 security modes

Tuya TYWE3SE Wi-Fi and Bluetooth

Module

Version: 1.0.1

Date: 2019-07-23

No.: 0000000001

Product

Manual

Global Intelligent Platform

Summary of content (26 pages)

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Tuya TYWE3SE Wi-Fi and Bluetooth Module Product Manual Version: 1.0.1 Date: 2019-07-23 Datasheet No.:TYWE3SE 0000000001 1. Product Overview TYWE3SE is a low-power embedded 2.4 GHz Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (ESP32) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.
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TYWE3SE Datasheet  Up to +20 dBm output power in 802.11b mode  Smart and AP network configuration modes for Android and iOS devices  Onboard PCB antenna with a gain of 2.5 dBi  Working temperature: –20°C to +85°C  Bluetooth connectivity  Complete Bluetooth 4.
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TYWE3SE Datasheet Change History No. Date Change Description Version After Change 1 2019-06-25 This is the first release. 1.0.0 2 2019-07-23 Added GPIO information. 1.0.
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TYWE3SE Datasheet Contents 1. Product Overview ...........................................................................................................1 1.1 Features ................................................................................................................1 1.2 Applications ...........................................................................................................2 Tables ...............................................................................................
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TYWE3SE Datasheet 6.2 Recommended PCB Encapsulation ....................................................................17 6.3 Production Instructions ........................................................................................18 6.4 Recommended Oven Temperature Curve ..........................................................20 6.5 Storage Conditions ..............................................................................................21 7. MOQ and Packing Information ..................
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TYWE3SE Datasheet Tables Table 2-1 TYWE3SE interface pins ....................................................................................7 Table 2-2 TYWE3SE test pins ............................................................................................9 Table 3-1 Absolute electrical parameters .........................................................................10 Table 3-2 Normal electrical conditions .............................................................................
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TYWE3SE Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint TYWE3SE has three rows of pins with a 2 mm pin spacing. The TYWE3SE dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The PCB thickness is 0.8±0.1 mm. The shield cover height is 2.5±0.05 mm. Figure 2-1 shows the TYWE3SE front and rear views. Figure 2-1 TYWE3SE front and rear views 2.2 Interface Pin Definition Table 2-1 TYWE3SE interface pins Pin No.
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TYWE3SE Datasheet Pin No. Symbol I/O Type 4 IO33 I/O Function Used as a GPIO, which is connected to 32K_XN (pin 13) on the internal IC 5 IO14 I/O Used as a GPIO, which is connected to MTMS (pin 17) on the internal IC 6 IO25 I/O Used as a GPIO, which is connected to GPIO25 (pin 14) on the internal IC 7 IO13 I/O Used as a GPIO, which is connected to MTCK (pin 20) on the internal IC 8 VDD P Power supply pin (3.
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TYWE3SE Datasheet Pin No. Symbol I/O Type Function initialization; cannot be pulled down when the module is powered on) 19 IO5 I/O Used as a GPIO, which is connected to GPIO_5 (pin 34) on the internal IC 20 GPIO22 I/O Used as a GPIO, which is connected to GPIO_22 (pin 39) on the internal IC 21 RXD I/O UART0_RXD (See the following Note 3.) 22 TXD Output UART0_TXD (See the following Note 3.) Note: 1.
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TYWE3SE Datasheet 3. Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Ts Storage Minimum Maximum Value Value Unit –40 125 °C –0.3 3.6 V Tamb = 25°C N/A 2 kV Tamb = 25°C N/A 0.5 kV temperature VDD Power supply voltage Static electricity voltage (human body model) Static electricity voltage (machine model) 3.
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TYWE3SE Datasheet Parameter VOH Description I/O high-level output Minimum Typical Maximum Value Value Value VDD x Unit N/A VDD V 0.8 Imax I/O drive current N/A N/A 16 mA Cpad Input pin capacitance N/A 2 N/A pF 3.3 RF Current Table 3-3 Current during constant transmission and receiving Parameter Working Status TX Typical Mode TX Power/ Rate Value Unit Receiving 802.11b 11 Mbit/s +18 dBm 220 mA 802.11g 54 Mbit/s +14 dBm 185 mA 802.11n MCS0 +14 dBm 200 mA 802.
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TYWE3SE Datasheet 3.4 Working Current Table 3-4 TYWE3SE working current Working Mode EZ Working Status (Ta = 25°C) The module is in EZ mode, and Average Maximum Value Value Unit 80 140 mA 90 430 mA 55 400 mA 80 430 mA the Wi-Fi indicator blinks quickly. AP The module is in AP mode, and the Wi-Fi indicator blinks slowly. Connected The module is connected to the network, and the Wi-Fi indicator is steady on.
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TYWE3SE Datasheet Antenna type PCB antenna with a gain of 2.5 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Average RF output power, Minimum Typical Maximum Value Value Value Unit 1 Mbit/s N/A 20 N/A dBm 54 Mbit/s N/A 14 N/A dBm MCS7 N/A 12 N/A dBm 1 Mbit/s –11 N/A 9 dBm –10 N/A +10 ppm 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode BLE TX power Frequency error EVM under 802.
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TYWE3SE Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode BLE Minimum Typical Maximum Value Value Value Unit 1 Mbit/s N/A –97.5 N/A dBm 54 Mbit/s N/A –75 N/A dBm MCS7 N/A –72 N/A dBm 1 Mbit/s –94 –92 –90 5. Antenna Information 5.1 Antenna Type TYWE3SE uses an onboard PCB antenna. 5.
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TYWE3SE Datasheet The preceding solutions ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. 5.3 Antenna Connector Specifications TYWE3SE does not use an antenna connector.
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TYWE3SE Datasheet 6. Packaging Information and Production Instructions 6.
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TYWE3SE Datasheet Figure 6-2 Side view Note: The default dimensional tolerance is ±0.25 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.
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TYWE3SE Datasheet Figure 6-4 PCB encapsulation diagram of TYWE3SE 6.3 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii.
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TYWE3SE Datasheet 2. ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. (2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC). Figure 6-5 HIC for TYWE3SE 3.
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TYWE3SE Datasheet (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6.
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TYWE3SE Datasheet Figure 6-6 Oven temperature curve 21
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TYWE3SE Datasheet 6.
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TYWE3SE Datasheet 7.
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TYWE3SE Datasheet 8. Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
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TYWE3SE Datasheet —Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
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TYWE3SE Datasheet EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 26