Data Sheet
Manuals
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Hangzhou Tuya Information Technology Manuals
Electronics
Wi-Fi and Bluetooth Module
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Table Of Contents
Contents
7MOQ and packaging in
1Product overview
1.1Features
1.2Applications
1.3Change history
2Module interfaces
2.1Dimensions and package
2.2Pin definition
3Electrical parameters
3.1Absolute electrical parameters
4.2Wi-Fi transmission performance
5.2Antenna interference reduction
6Packaging information and production instructions
6.1Mechanical dimensions
6.2Side view
6.3.1 PCB packaging diagram-SMT
6.5Recommended oven temperature curve
Manner 1: SMT process (Recommended oven temperatur
Manner 2: Wave soldering process (Oven temperature
6.6Storage conditions
8Appendix-Statement
Radiation Exposure Statement
Important Note
Declaration of Conformity European Notice
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MODULE
IN
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A
CE
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2.2
Pin
definition
Pin
number
Symb
ol
I/O
type
Func
tion
1
P8
I/O
Supp
ort
har
dware
PWM
2
P7
I/O
Supp
ort
har
dware
PWM
3
P6
I/O
Supp
ort
har
dware
PWM
4
P26
I/O
Supp
ort
har
dware
PWM
5
P24
I/O
Supp
ort
har
dware
PWM
1
...
...
5
6
7
8
9
...
...
30
