Data Sheet
Manuals
Brands
Hangzhou Tuya Information Technology Manuals
Electronics
Wi-Fi and Bluetooth Module
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Table Of Contents
Contents
7MOQ and packaging in
1Product overview
1.1Features
1.2Applications
1.3Change history
2Module interfaces
2.1Dimensions and package
2.2Pin definition
3Electrical parameters
3.1Absolute electrical parameters
4.2Wi-Fi transmission performance
5.2Antenna interference reduction
6Packaging information and production instructions
6.1Mechanical dimensions
6.2Side view
6.3.1 PCB packaging diagram-SMT
6.5Recommended oven temperature curve
Manner 1: SMT process (Recommended oven temperatur
Manner 2: Wave soldering process (Oven temperature
6.6Storage conditions
8Appendix-Statement
Radiation Exposure Statement
Important Note
Declaration of Conformity European Notice
Contents
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MOQ
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packaging
information
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ppendix-Statement
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