Data Sheet
Manuals
Brands
Hangzhou Tuya Information Technology Manuals
Electronics
Wi-Fi and Bluetooth Module
11
12
13
14
15
16
17
18
19
20
Table Of Contents
Contents
7MOQ and packaging in
1Product overview
1.1Features
1.2Applications
1.3Change history
2Module interfaces
2.1Dimensions and package
2.2Pin definition
3Electrical parameters
3.1Absolute electrical parameters
4.2Wi-Fi transmission performance
5.2Antenna interference reduction
6Packaging information and production instructions
6.1Mechanical dimensions
6.2Side view
6.3.1 PCB packaging diagram-SMT
6.5Recommended oven temperature curve
Manner 1: SMT process (Recommended oven temperatur
Manner 2: Wave soldering process (Oven temperature
6.6Storage conditions
8Appendix-Statement
Radiation Exposure Statement
Important Note
Declaration of Conformity European Notice
6
PA
CKAG
IN
G
INFORMATI
ON
AND
PRODUCTION
INSTRUCTI
ONS
16
/
27
6
Packaging
information
and
production
instructions
6.1
Mechanical
dimensions
The
dime
nsions
of
the
PCB
a
re
17.3±0.35
mm
(L)×15±0.
35
mm
(W)
×0.8±0.1
mm
(H).
6.2
Side
view
1
...
...
17
18
19
20
21
...
...
30
