Data Sheet
Table Of Contents
- 1.General Overview
- 1.1.Introduction
- 1.2.Features
- 1.3.Parameters
- 1.4.Ultra Low Power Technology
- 1.5.Major Applications
- 2.Hardware Overview
- 3.Pins and Definitions
- 3.1.GPIO
- 3.2.Secure Digital Input/Output Interface (SDIO)
- 3.3.Serial Peripheral Interface (SPI/HSPI)
- 3.4.Inter-integrated Circuit Interface (I2C)
- 3.5.I2S
- 3.6.Universal Asynchronous Receiver Transmitter (UART)
- 3.7.Pulse-Width Modulation (PWM)
- 3.8.IR Remote Control
- 3.9.ADC (Analog-to-digital Converter)
- 3.10.LED Light and Button
- 4.Firmware & Software Development Kit
- 5.Power Management
- 6.Clock Management
- 8.FCC Warming Statement
- This device complies with part 15 of the FCC Rules
- (1)This device may not cause harmful interference,
- (2)and this device must accept any interference re
- FCC Radiation Exposure Statement:
- This equipment complies with FCC radiation exposur
- Information to the user.
- Note: This equipment has been tested and found to
- -Reorient or relocate the receiving antenna.
- -Increase the separation between the equipment and
- -Connect the equipment into an outlet on a circuit
- -Consult the dealer or an experienced radio/TV tec
- 9.Appendix: QFN32 Package Size
ESP8266 Datasheet
Espressif Systems
Espressif Systems
June1,2015
2
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32
Table of Contents
1.
General Overview...................................................................................................6
1.1.
Introduction
..................................................................................................................
6
1.2.
Features
........................................................................................................................
7
1.3.
Parameters
...................................................................................................................
7
1.4.
Ultra Low Power Technology
....................................................................................
9
1.5.
Major Applications
......................................................................................................
9
2.
Hardware Overview............................................................................................. 11
2.1.
Pin Definitions
.............................................................................................................
11
2.2.
Electrical Characteristics
..........................................................................................
13
2.3.
Power Consumption
.................................................................................................
13
2.4.
Receiver Sensitivity
.................................................................................................
14
2.5.
MCU…………
............................................................................................................
15
2.6.
Memory Organization
..............................................................................................
15
2.6.1.
Internal SRAM and ROM
........................................................................................
15
2.6.2. External SPI Flash..................................................................................................... 15
2.7.
AHB and AHB Blocks
..............................................................................................
16
3.
Pins and Definitions............................................................................................. 17
3.1.
GPIO………………
..................................................................................................
17
3.1.1.
General Purpose Input/Output Interface (GPIO)
...............................................
17