Specifications
11
–
Cabinet baking box
–
Anti-static and high temperature resistant tray
–
Anti-static and high temperature resistant gloves
•
JFTECH modules need to be baked if they encounter the following possible
moisture conditions
:
–
The vacuum packaging bag was found to be damaged before unpacking
–
After unpacking, it was found that there is no humidity indicator card in the
bag
–
After unpacking, if the humidity indicator card reads 10% and above, the
color ring turns pink
–
The total exposure time after unpacking exceeds 168 hours
•
More than 12 months from the date of the first sealed packaging
•
The baking parameters are as follows
:
–
Baking temperature
:
Reel packaging 60
℃,
less than or equal to 5%RH
;
tray packaging 125
℃,
less than or equal to 5%RH
–
(
The high temperature resistant tray is not a blister box drag tray
)
–
Baking time
:
Reel packaging 48 hours
,
tray packaging 12 hours
–
Alarm temperature setting
:
Reel packaging 65
℃,
tray packaging 135
℃
–
After cooling to below 36
℃
under natural conditions, production can be
carried out
–
If the exposure time after baking is more than 168 hours and not run
out,need to bake again
–
If the exposure time exceeds 168 hours and has not been baked, it is not
recommended to use the wave soldering process to weld this batch of
modules. Because the module is a level 3 moisture-sensitive device, it is
likely to be dampened beyond the allowable exposure time, and high
temperature welding may cause device failure or poor welding.
•
Please protect the module from electrostatic discharge (ESD) during the entire
production process
。
•
In order to ensure the good quality of the product, the production needs to focus
on the amount of flux sprayed.The height of the wave peak, whether the tin slag
and copper content in the wave soldering cylinder exceed the standard, whether
the window opening of the wave soldering fixture and the thickness of the fixture