User's Manual

3.
4
3.
5
S
V
E
S

4.
4.
1
O
p
Wi
M
o
Da
An
4.
2
M
o
4
Absol
u
Symbol
T
STG
T
A
Humidit
5
Absol
u
S
ymbol
S
D
(HBM)
RF Ch
a
1
Basic C
p
eratingFreq
u
-FiStandard
o
dulationTyp
ta Rates
tennatype
2
IEEE80
o
dulationTyp
u
te max
i
N
u
te max
i
Rati
n
Electrostati
c
discharge v
o
(human bo
d
a
racte
r
haracte
r
Item
u
ency
e
2.11b
M
Item
e
i
mum r
a
R
Storage
t
Working
on condensi
n
i
mum r
a
n
gs
c
o
ltage
d
y model)
r
istics
r
istics
M
ode
a
tings –
R
a
t
emperature
temperatur
e
n
g, relative h
u
a
tings –
Conditio
n
TA = +25 °
conformin
g
JESD22-A1
2.412 GH
z
IEEE 802.
1
11b: DBP
S
11g: BPS
K
11n: MCS
11b:1,2,5.
5
11g:6,9,1
2
11n:MCS
0
IPEX con
n
PCBprint
e
DSSS/CC
K
Temper
–
e
u
midit
y
ESD
n
s Class
C
g
to
14
2
Specificat
i
z
- 2.462 GH
z
1
1b/g/n
S
K, DQPSK,C
K
, QPSK, 16
Q
0~7,OFDM
5
and 11Mb
p
2
,18,24,36,48
0
~7,up to15
0
n
ectorforext
e
e
dANT
Specificat
i
K
8
w
ature
Max
–
40 to+125
-10 to+70
90%（RH）
Max
2000
i
on
z
CK for DSSS
Q
AM, 64QA
M
p
s
and 54 Mb
p
0
Mbps
e
rnalantenna
i
on
w
ww.ibroadlin
k
Uni
℃
℃
Unit
V
M
for OFDM
p
s
k
.com
t