Data Sheet

HCF4093 Package mechanical data
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4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5. Plastic DIP-14 package outline
1. Drawing not to scale.
Table 8. Plastic DIP-14 mechanical data
Symbol
millimeters inches
Min Typ Max Min Typ Max
a1 0.51 0.020
B 1.39 1.65 0.055 0.065
b0.5 0.020
b1 0.25 0.010
D200.787
E8.5 0.335
e 2.54 0.100
e3 15.24 0.600
F 7.1 0.280
I 5.1 0.201
L3.3 0.130
Z 1.27 2.54 0.050 0.100
P001A