Product Data Sheet

Guangzhou ZHIYUAN Electronics Co., Ltd.
Wireless Communication Module
Product Datasheet ©2018 Guangzhou ZHIYUAN Electronics Co., Ltd.
1
ZM32 Datasheet
Content
1. Introduction ........................................................................................................... 1
1.1 Introduction ............................................................................................................... 1
1.2 Module Naming Rule ................................................................................................ 1
1.3 Product Selection ...................................................................................................... 2
2. Dimensions............................................................................................................ 3
3. Interface ................................................................................................................ 4
3.1 Pin Assignment.......................................................................................................... 4
3.2 Pin Description .......................................................................................................... 4
4. Electrical Parameters ............................................................................................. 6
4.1 Operating Conditions ................................................................................................ 6
4.2 Operating Environment ............................................................................................. 6
4.3 Power consumption ................................................................................................... 6
5. RF Parameters ....................................................................................................... 7
6. Production Guidance ............................................................................................. 8
6.1 Recommended production reflow temperature curve ............................................... 8
6.2 Recommended production reflow temperature and time comparison table .............. 8
7. Hardware Design Precautions ................................................................................ 9
7.1 Smallest System ........................................................................................................ 9
7.2 Recommended System .............................................................................................. 9
7.3 Recommended Layout............................................................................................. 10
8. FCC Statement ..................................................................................................... 11
9. Disclaimer ............................................................................................................12