Product Specs

物联科技 选威士丹利
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Figure 7-1 Humidity
Card Inspection
VII. Matters needing attention in production
1 Shelf life of modules
a) Shelf life: 12 months, storage environment: temperature < 40℃, humidity < 90% R.H
b) Inventory control: the principle of "first in, first out"
2 Time limit for SMT assembly after the module is unpacked
a) Check the humidity card (as shown in Figure 6-1): the displayed value should be
less than 20% (blue); If > 30% (red), it means that the module has absorbed
moisture.
b) Temperature and humidity control of SMT workshop environment: work at a temperature of 25℃
(4℃) and a humidity of 60% r.h (20%).
c) After baking, it can be used in SMT production immediately, or put in a proper
amount of desiccant, then sealed and packaged, and stored in a drying cabinet.
3 Unpacked module, if not used up within 48 hours.
a) The module must be baked again to remove the moisture absorption problem of the module.
b) Baking temperature and time condition
 Baking temperature: 60℃ in reel packaging; Packing tray at 60℃
 Baking time: 8 hours in reel packaging; Pack the tray for 4 hours.
 If the exposure time after baking is more than 168 hours, please bake again.
VIII. MOQ of Module and Packaging Information
product
model
MOQ（PCS）
Packaging method of
blister tray
Packing
method
Number of
modules per
disk
Number of
trays per box
Number of
modules per
disk
VZS2R1
1K
80PCS
25
1000PCS