User Manual

SUBJECT TO CHANGE WITHOUT PRIOR NOTICE © 2015 - GT-TRONICS REV 05 2016-02-02
 Module Reflow Installation
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
Profile Feature Recommended Parameters
Ramp-up rate before liquidous < 2°C / second
Preheat 150-200°C 60-90 seconds
Maximum time at liquidous 40 – 80 seconds
Maximum peak temperature 230° - 240°C (below 250°C)
Ramp-down rate < 6°C / second