Data Sheet
Table Of Contents
- 1. General description
- 2. Features
- 3. Applications
- 4. Feature selection
- 5. Ordering information
- 6. Block diagram
- 7. Pinning information
- 8. Functional description
- 9. Application design-in information
- 10. Limiting values
- 11. Characteristics
- 12. Test information
- 13. Package outline
- 14. Soldering
- 15. Abbreviations
- 16. Revision history
- 17. Data sheet status
- 18. Definitions
- 19. Disclaimers
- 20. Trademarks
- 21. Contact information
- 22. Contents

PCA9512A_1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 October 2005 16 of 22
Philips Semiconductors
PCA9512A
Level shifting hot swappable I
2
C-bus and SMBus bus buffer
13. Package outline
Fig 16. Package outline SOT96-1 (SO8)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
99-12-27
03-02-18