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Data Sheet

ManualsBrandsGravitech ManualsMisc. IR & Light SensorsI2C 16-BIT Color Level Sensor RGBC
31323334353637383940
TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
35
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
PACKAGE FN Dual Flat No-Lead
203 8
6 GND
5 Vdd
4 INT
SCL 1
SYNC 2
SDA 3
T
OP VIEW
SIDE VIEW
BOTTOM VIEW
300
50
950
3000
100
3000
100
PIN 1
PIN 1
END VIEW
650 50
PIN OUT
TOP
VIEW
950 150
PHOTODIODE ARRAY
295
Nominal
Lead Free
Pb
350 10
1565
10
128 Nominal
C
L
of Solder Contacts
C
L
of Photodiode
Array Area
(Note B)
C
L
of Solder Contacts and
Photodiode Array Area (Note B)
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The die is centered within the package within a tolerance of ± 3 mils.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 32. Package FN — Dual Flat No-Lead Packaging Configuration