Data Sheet

TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
34
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
PACKAGE CS Six-Lead Chipscale
950
Nominal
350
 10
1565
 10
2095
463  30
610 Nominal
438  30
TOP VIEW
BOTTOM VIEW
END VIEW
Lead Free
Pb
6   300  30
PINOUT
TOP VIEW
SCL
A1
SYNC
A2
GND
A3
B1
SDA
B2
V
DD
B3
INT
PHOTODIODE ARRAY
1875
128 Nominal
C
L
of Solder Bumps and
Photodiode Array Area
6  160  30
405  20
685  45
C
L
of Solder Bumps
C
L
of Photodiode
Array Area
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
D. This drawing is subject to change without notice.
Figure 31. Package CS — Six-Lead Chipscale Packaging Configuration