User Guide

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GM500-U1G_A
Hardware Development Guide
2.16. GPIO Interface ................................................................................................................................................................................. 49
2.17. USB_BOOT ................................................................................................................................................................................. 50
2.18. SD Card Interface ............................................................................................................................................................................. 50
2.19. SGMII Interface ................................................................................................................................................................................ 52
3. Antenna Interface ....................................................................................................................................................................... 54
3.1. Pin Definition ................................................................................................................................................................................. 54
3.2. Reference Design ............................................................................................................................................................................... 54
3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 56
3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 56
3.4.1. EMC Design Requirements ...................................................................................................................................................... 56
3.4.2. ESD Design Requirements ....................................................................................................................................................... 56
3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 57
4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 58
4.1. Absolute Maximum Ratings ............................................................................................................................................................... 58
4.2. Operating Temperature ..................................................................................................................................................................... 58
4.3. Electrostatic Discharge ...................................................................................................................................................................... 58
4.4. GM500-U1G_A Test ........................................................................................................................................................................... 58
4.4.1. Current Consumption .............................................................................................................................................................. 58
4.4.2. RF Output Power ..................................................................................................................................................................... 59
4.4.3. RF Receiving Sensitivity ........................................................................................................................................................... 59
4.5. GNSS Technical Parameters ............................................................................................................................................................... 60
5. Mechanical Dimensions .............................................................................................................................................................. 61
5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 61
5.2. Footprint of Recommendation .......................................................................................................................................................... 62
6. Related Test & Test Standard ...................................................................................................................................................... 64
6.1. Testing Reference .............................................................................................................................................................................. 64
6.2. Description of Testing Environment .................................................................................................................................................. 64
6.3. Reliability Testing Environment ......................................................................................................................................................... 65
7. SMT Process and Baking Guide .................................................................................................................................................... 66
7.1. Storage Requirements ....................................................................................................................................................................... 66
7.2. Module Plainness Standard ............................................................................................................................................................... 66
7.3. Process Routing Selection .................................................................................................................................................................. 66
7.3.1. Solder Paste Selection ............................................................................................................................................................. 66
7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 66
7.3.3. Module Board’s SMT process .................................................................................................................................................. 67
7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 68
7.3.5. Reflow method ........................................................................................................................................................................ 69
7.3.6. Maintenance of defects .......................................................................................................................................................... 69
7.4. Module’s Baking Requirements ......................................................................................................................................................... 69
7.4.1. Module’s Baking Environment ................................................................................................................................................ 69
7.4.2. Baking device and operation procedure ................................................................................................................................. 70