User Guide

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GM500-U1G_A
Hardware Development Guide
The following picture is the tape reel specific dimension for your reference:
A: Whole dimension:
B: Detailed dimension:
Figure 7–3 Tape Reel Dimension
3） Mounting Pressure:
In order to ensure a good contact between the module and the solder paste on main board, the pressure of placing the module
board on main board should be 2-5N according to our experiences. Different modules have different numbers of pads, therefore the
pressure selected are different. Customers can select proper pressure based on their own situations to suppress the module paste as
little as possible, in order to avoid the surface tension of the solder paste melts too much to drag the module during reflow.
7.3.4. Module Soldering Reflow Curve
Module soldering furnace temperature curve is:

Peak value: 245+0/-5℃

≥217℃: 30〜〜60S

150〜200℃: 60〜〜120S

Temperature rise slope: <3℃/S