User Guide

GM500-U1G_A

Hardware Development Guide

6. Related Test & Test Standard

6.1. Testing Reference

The related tests of MODULE comply with the IEC standard, including the equipment running under high/low temperature,

storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related

testing standards for MODULE.

Table 6-1 Testing Standard

NOTE:

 IEC: International Electro technical Commission;

 GB/T: Recommended national standard

Test Standard Document Reference

IEC6006826 Environmental testing-Part2.6: Test FC: Sinusoidal Vibration

IEC60068234 Basic environment testing procedures part2.

IEC60068264 Environmental testing-part2-64: Test FH: vibration, broadband random and guidance.

IEC60068214 Environmental testing-part 2-14: Test N: change of temperature

IEC60068229 Basic environmental testing procedures-part2: Test EB and guidance.

IEC6006822 Environmental testing-part2-2: Test B:dry heat

IEC6006821 Environment testing-part2-1: Test A: cold.

GB/T 15844.2 MS telecommunication RF wireless phone-set environment requirement & experimental method – part 4: Strict level of

experimental condition

GB/T 2423.17 Basic environment experiment of electronic products-Experiment Ka: Salt mist experiment method

GB/T 2423.5 Basic environment experiment of electronic products-Part2: Experiment method Try Ea & Introduction: Shock

GB/T 2423.11 Basic environment experiment of electronic products-Part2: Experiment method Try Fd: Broad frequency band random vibration

(General requirement)

TIA/EIA 603 3.3.5

TIA Standard-part3-5:Shock Stability

6.2. Description of Testing Environment

The working temperature range of MODULE is divided into the normal working temperature range and the extreme working

temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP

specifications, and its function is normal. Under the extreme temperature range, the RF index basically complies with the 3GPP

specifications, and the quality of data communication is affected to a certain extent, but its normal function is not affected. MODULE

has passed the EMC test. Table 6-2 is the requirement for the testing environment, and Table 6-3 lists out the instruments and devices

that might be used during the test.

WARNING:

Table 6-2 lists the extreme working conditions for the Module. Using the Module beyond these conditions

may result in permanent damage to the module.

Table 6-2 Testing Environment

Working Condition Min Temperature Max Temperature Remark