Datasheet

GE-C1602B-TMI-JT/R page 24/ 26 29.07.2010
NO Item Criterion
AQL
07 Cracked glass
The LCD with extensive crack is not acceptable.
2.5
08
Backlight
elements
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged. Using
LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or colour wrong.
0.65
2.5
0.65
09 Bezel
9.1 Bezel may not have rust, be deformed or have fingerprints,
stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10
PCB、COB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
Y
X
X * Y<=2mm
2
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
11 Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections, oxidation or
icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
2.5
0.65