User's Manual

8
Revision 1.1, Copyright © 2014, Impinj, Inc.
Parameter
Min.
Max.
Unit
Conditions
ESD immunity
-
2
kV
Human-body model, all I/O pads
Package moisture
sensitivity level 3
-
-
-
Indy RS500 from open trays must be baked
before going through a standard solder
reflow process (48 hours at 125 ºC or 24hrs
at 150 ºC)
4.2 Operating Conditions
This section describes operating voltage, frequency, and temperature specifications for
the Indy RS500 during operation.
Table 5-2: Indy RS500 – Operating Conditions
Parameter
Min.
Max.
Unit
Conditions
Supply
3.6
5.25
V
VDC_IN relative to GND
Temperature
-20
+70
ºC
Ambient Temperature
Frequency
902
928
MHz
IPJ-RS500-GX, See section 5.6 for regional support
Frequency
865
868
MHz
IPJ-RS500-EU, See section 5.6 for regional support
4.3 Device Functional Specifications
Table 5-3: Indy RS500 – Supply Current Specifications
Parameter
Typ.
Unit
Description
Supply Current
Current consumed by RS500 via VDC_IN pin
Active mode - 5V
supply – GX
510
mA
+23 dBm transmit power
Inventorying tags
Active mode - 5V
supply - EU
580
mA
+23 dBm transmit power
Inventorying tags
Active mode -
3.6V supply
570
mA
+23 dBm transmit power
Inventorying tags
Idle mode –
low latency
50
mA
Ready to receive IRI packets. Lower latency to return
to Active mode.
Idle mode –
standard latency
15
mA
Ready to receive IRI packets.
Standby mode
1
mA
GPIO activity or WKUP rising edge required to wakeup
part.
Sleep mode
<100
µA
WKUP rising edge required to wakeup part.