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Revision 1.1, Copyright © 2014, Impinj, Inc.
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Figure 8-6: RS500 Recommended Pastemask Footprint – Single Pad
It is important to note that the optimal pad and stencil design results in a stencil aperture
that is of a different shape than and that overhangs the etched pad. This design delivers
the optimum amount of solder to the castellation of the SiP pad. Figure 8-7 depicts the
pad/solder relationship.
Figure 8-7: Recommended Solder Stencil Opening with Etched Pad for RS500