Indy® RS500 Datasheet IPJ-RS500-GX, IPJ-RS500-EU Electrical, Mechanical, & Thermal Specification Indy® RS500 Overview Indy RS500 is a completely integrated UHF reader SiP (system-in-package). It can be easily added to an embedded system, requiring only connections to a power source, digital communication with a host, and an antenna. The package design allows it to be attached to a PCB using standard surface mount technology (SMT), with no need for additional connectors or mounting hardware.
1 Table of Contents INDY® RS500 OVERVIEW .......................................................................................................................... 1 1 TABLE OF CONTENTS ......................................................................................................................... 2 1.1 FIGURES ............................................................................................................................................ 2 1.2 TABLES ..................................
TABLE 5-6: INDY RS500 – RF TRANSMITTER SPECIFICATIONS ........................................................................ 10 TABLE 5-7: INDY RS500 – DIGITAL INTERFACE SPECIFICATION ........................................................................ 11 TABLE 5-8: INDY RS500 – ANALOG INTERFACE SPECIFICATION ....................................................................... 12 TABLE 5-9: INDY RS500 – REGIONAL SUPPORT................................................................................
Figure 2-1: RS500 System Integration DC Power Host UART Antenna Three simple connections: DC Power UART Communication RF Antenna 2.
solid lines. Recommended and optional connections are illustrated with different dotted and dashed line patterns. They are also listed below. For more detail on pin characteristics and behaviors, see the RS500 Hardware User’s Guide. Figure 3-1: Example RS500 Block Diagram 3.6 - 5.25 V UART1 RX & TX VDC_IN Test Points UC_ADC & UC_DAC UART2 RX & TX STATUS & HEALTH GND GPIOs Indy RS500 SiP RF User Def.
GPIOs allow interaction with the RS500 as both digital inputs and outputs. They may be used to trigger inventory, generate events based on inventory activity, or provide general-purpose user-controlled digital I/O. WKUP provides a mechanism to wake up the RS500 from the low power Sleep mode. WKUP is also used to force entry into the Impinj firmware bootstrap. If unused, this pin should be tied to logic low. UC_ADC allows use of an ADC to convert an analog input voltage into a digital value.
4 Electrical Specifications 4.1 Absolute Maximum Ratings The absolute maximum ratings (see Table 5-1) define limitations for electrical and thermal stresses. These limits prevent permanent damage to the Indy RS500. Operation outside maximum ratings may result in permanent damage to the device. Table 5-1: Indy RS500 – Absolute Maximum Ratings Parameter Min. Max. Unit Conditions Supply voltage -0.3 5.5 V VDC_IN pin relative to GND IO voltage -0.3 4.
Parameter Min. ESD immunity - Package moisture sensitivity level 3 4.2 Max. 2 - - Unit Conditions kV Human-body model, all I/O pads - Indy RS500 from open trays must be baked before going through a standard solder reflow process (48 hours at 125 ºC or 24hrs at 150 ºC) Operating Conditions This section describes operating voltage, frequency, and temperature specifications for the Indy RS500 during operation. Table 5-2: Indy RS500 – Operating Conditions Parameter 4.3 Min. Max.
Table 5-4: Indy RS500 – Startup and Wakeup Time Parameter Min. Startup Time Typ. Max. Unit 200 Description ms Time to receive IRI packets after power supply or nRST pin initiated startup Wakeup Time Time to receive IRI packets after wakeup event Standby 50 ms GPIO activity or WKUP rising edge required to wakeup part. Sleep 200 ms WKUP rising edge required to wakeup part. 4.4 UHF Gen 2 RFID Radio Specifications Table 5-5: Indy RS500 – RF Receiver Specifications Parameter Min. Typ.
4.5 Device Input and Output Specifications Table 5-7: Indy RS500 – Digital Interface Specification Parameter Min. Typ. Max. Unit Conditions nRST VIL -0.3 0.8 V VIH 2 3.6 V Hysteresis voltage 200 Internal pull-up resistor 25 Reset pulse width 25 40 mV 55 kΩ µs BOOT0 VIL 0.0 0.6 V VIH 0.62 3.6 V Hysteresis voltage 300 mV WKUP VIL -0.3 1.0 V VIH 1.8 3.6 V Hysteresis voltage Internal pull-down resistor 200 25 40 mV 55 kΩ Digital inputs VIL -0.3 1.0 V VIH 1.
Table 5-8: Indy RS500 – Analog Interface Specification Parameter Min. Typ. Max. Unit Conditions ADC (Pin 13) Resolution 12 Bits Conversion voltage range 1 3.3 V Sampling rate 0.05 1 MSPs Total conversion time 1 18 µsec Power-up time 1 µsec External input impedance 50 kΩ Sampling switch resistance 1 kΩ Internal sample and hold capacitance 8 pF Total unadjusted error ±3.3 ±4 LSB Offset error ±1.9 ±2.8 LSB Gain error ±2.8 ±3 LSB DNL error ±0.7 ±1.
4.
Region 14 SKU India IPJ-RS500-EU Indonesia IPJ-RS500-GX Ireland IPJ-RS500-EU Israel IPJ-RS500-GX Italy IPJ-RS500-EU Japan (916-921 MHz) IPJ-RS500-GX Korea (917-921 MHz) IPJ-RS500-GX Latvia IPJ-RS500-EU Lithuania IPJ-RS500-EU Luxembourg IPJ-RS500-EU Macedonia IPJ-RS500-EU Malaysia (919-923 MHz) IPJ-RS500-GX Malta IPJ-RS500-EU Mexico IPJ-RS500-GX Moldova IPJ-RS500-EU Netherlands IPJ-RS500-EU New Zealand (921-928 MHz) IPJ-RS500-GX Norway IPJ-RS500-EU Oman IPJ-RS500-EU P
Region 4.
Table 5-12: Indy RS500 – Inventory Performance Parameter Inventory Rate 5 Min. Typ. Max. Unit Conditions 130 Tags/sec 1 Tag with tag population estimate = 1 35 Tags/sec 1 Tag with tag population estimate = 16 50 Tags/sec 16 Tags with tag population estimate = 16 Impinj Radio Interface (IRI) The Indy RS500 uses IRI to enable communications; this is enabled with the IRI Tool Kit. The IRI Tool Kit includes documentation, IRI API, and sample C code.
Please refer to the documentation included in the RS500 release package for complete details on communicating with the Indy RS500 using IRI. The latest Indy RS500 release package, which includes the IRI Tool Kit, can be downloaded at support.impinj.com. 6 Regulatory Information The Indy RS500 (IPJ-RS500) has been certified for modular operation by FCC and Industry Canada in certain specific configurations.
Table 8-1: RS500 Serial # Makeup Digits Meaning XX SKU code: 01 = GX 02 = EU ZZ Lot number WW Workweek produced YY Year produced AAAA Serial number within the lot Figure 8-2: RS500 Pin Dimensions (viewed from underneath package) Note. Callouts A and B show package markings that will vary depending on the manufacturing lot of the RS500 unit. 18 Revision 1.1, Copyright © 2014, Impinj, Inc.
7.3 PCB Footprint Recommended footprint copper and pastemask dimensions are shown in Figure 8-3 and Figure 8-5. Dimensions for the individual pads are shown in Figure 8-4 and Figure 8-6. Figure 8-3: RS500 Recommended Etched Copper Footprint – All Pads Revision 1.1, Copyright © 2014, Impinj, Inc.
Figure 8-4: RS500 Recommended Etched Copper Footprint – Single Pad 20 Revision 1.1, Copyright © 2014, Impinj, Inc.
Figure 8-5: RS500 Recommended Pastemask Footprint – All Pads 22 Revision 1.1, Copyright © 2014, Impinj, Inc.
Figure 8-6: RS500 Recommended Pastemask Footprint – Single Pad It is important to note that the optimal pad and stencil design results in a stencil aperture that is of a different shape than and that overhangs the etched pad. This design delivers the optimum amount of solder to the castellation of the SiP pad. Figure 8-7 depicts the pad/solder relationship. Figure 8-7: Recommended Solder Stencil Opening with Etched Pad for RS500 Revision 1.1, Copyright © 2014, Impinj, Inc.
7.4 SMT Reflow Information No-clean Type 3 Sn3Ag0.5Cu Solder Paste (Koki S3X58- M650) was used during Impinj’s testing of the Indy RS500. The solder manufacturer’s recommended reflow profile is shown in Figure 8-8. Figure 8-8: Recommended Solder Reflow Profile for the Indy RS500 24 Revision 1.1, Copyright © 2014, Impinj, Inc.
8 Document Change Log Table 9-1: Document Change Log Version Date 1.0 1.1 9 Description Initial version 4/30/2014 Package drawings updated Spec clarifications Regulatory information moved to Hardware User’s Guide Formatting updates Change log added Notices Copyright © 2014, Impinj, Inc. All rights reserved. Impinj gives no representation or warranty, express or implied, for accuracy or reliability of information in this document.
Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This module can be used with T800 or similar platform with similar dimension, antenna location and RF characteristic. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed at the same location as tested in the certification filing, and 2) 3) the maximum antenna gain allowed for use with this device is 4.41 dBi.
