User's Manual

Table Of Contents
PR533_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.6 — 27 October 2014
206436 8 of 36
NXP Semiconductors
PR533
USB NFC integrated reader solution
8. Recommended operating conditions
[1] V
SSA
, V
DDD
and V
DD(TVDD)
shall always be on the same voltage level.
[2] Supply voltages below 3 V reduces the performance (e.g. the achievable operating distance).
9. Thermal characteristics
10. Characteristics
Unless otherwise specified, the limits are given for the full operating conditions. The
typical value is given for 25 C, V
DDD
= 3.4 V and V
DD(PVDD)
= 3 V in non-USB bus power
mode, V
BUS
= 5 V in USB power mode.
Timings are only given from characterization results.
10.1 Power management characteristics
10.1.1 Current consumption characteristics
Typical value using a complementary driver configuration and an antenna matched to
40 between TX1 and TX2 at 13.56 MHz.
Table 5. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
V
BUS
bus supply voltage V
SSA
= V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V 4.02 5 5.25 V
supply voltage (non-USB mode); V
BUS
= V
DDD
;
V
SSA
= V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
2.53.3 3.6V
V
DDA
analog supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DDD
digital supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DD(TVDD)
TVDD supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DD(PVDD)
PVDD supply volt-
age
supply pad for host interface;
V
DDA
=V
DDD
=V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[2]
1.6 1.8 to 3.3 3.6 V
T
amb
ambient tempera-
ture
30 +25 +85 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air with exposed pad
soldered on a 4 layer Jedec
PCB-0.5
-3741.1K/W