User's Manual
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Quick reference data
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Limiting values
- 8. Recommended operating conditions
- 9. Thermal characteristics
- 10. Characteristics
- 10.1 Power management characteristics
- 10.2 Antenna presence self test thresholds
- 10.3 Typical 27.12 MHz Crystal requirements
- 10.4 Pin characteristics for 27.12 MHz XTAL Oscillator (OSCIN, OSCOUT)
- 10.5 RSTPD_N input pin characteristics
- 10.6 Input pin characteristics for I0, I1 and TESTEN
- 10.7 RSTOUT_N output pin characteristics
- 10.8 Input/output characteristics for pin P70_IRQ
- 10.9 Input/output pin characteristics for P30 / UART_RX, P31 / UART_TX, P32_INT0, P33_INT1
- 10.10 Input/output pin characteristics for P35
- 10.11 Input/output pin characteristics for DP and DM
- 10.12 Input pin characteristics for SCL
- 10.13 Input/output pin characteristics for SDA
- 10.14 Output pin characteristics for DELATT
- 10.15 Input pin characteristics for SIGIN
- 10.16 Output pin characteristics for SIGOUT
- 10.17 Input/output pin characteristics for P34
- 10.18 Output pin characteristics for LOADMOD
- 10.19 Input pin characteristics for RX
- 10.20 Output pin characteristics for AUX1/AUX2
- 10.21 Output pin characteristics for TX1/TX2
- 10.22 System reset timing
- 10.23 Timing for the I2C-bus interface
- 10.24 Temperature sensor
- 11. Application information
- 12. Abbreviations
- 13. Revision history
- 14. Legal information
- 15. Contact information
- 16. Tables
- 17. Figures
- 18. Contents

PR533_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.6 — 27 October 2014
206436 8 of 36
NXP Semiconductors
PR533
USB NFC integrated reader solution
8. Recommended operating conditions
[1] V
SSA
, V
DDD
and V
DD(TVDD)
shall always be on the same voltage level.
[2] Supply voltages below 3 V reduces the performance (e.g. the achievable operating distance).
9. Thermal characteristics
10. Characteristics
Unless otherwise specified, the limits are given for the full operating conditions. The
typical value is given for 25 C, V
DDD
= 3.4 V and V
DD(PVDD)
= 3 V in non-USB bus power
mode, V
BUS
= 5 V in USB power mode.
Timings are only given from characterization results.
10.1 Power management characteristics
10.1.1 Current consumption characteristics
Typical value using a complementary driver configuration and an antenna matched to
40 between TX1 and TX2 at 13.56 MHz.
Table 5. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
V
BUS
bus supply voltage V
SSA
= V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V 4.02 5 5.25 V
supply voltage (non-USB mode); V
BUS
= V
DDD
;
V
SSA
= V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
2.53.3 3.6V
V
DDA
analog supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DDD
digital supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DD(TVDD)
TVDD supply volt-
age
V
DDA
= V
DDD
= V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[1][2]
2.53.3 3.6V
V
DD(PVDD)
PVDD supply volt-
age
supply pad for host interface;
V
DDA
=V
DDD
=V
DD(TVDD)
= V
DD(PVDD)
;
V
SSA
=V
SSD = VSS(PVSS)
= V
SS(TVSS)
= 0 V
[2]
1.6 1.8 to 3.3 3.6 V
T
amb
ambient tempera-
ture
30 +25 +85 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air with exposed pad
soldered on a 4 layer Jedec
PCB-0.5
-3741.1K/W