User's Manual
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Quick reference data
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Limiting values
- 8. Recommended operating conditions
- 9. Thermal characteristics
- 10. Characteristics
- 10.1 Power management characteristics
- 10.2 Antenna presence self test thresholds
- 10.3 Typical 27.12 MHz Crystal requirements
- 10.4 Pin characteristics for 27.12 MHz XTAL Oscillator (OSCIN, OSCOUT)
- 10.5 RSTPD_N input pin characteristics
- 10.6 Input pin characteristics for I0, I1 and TESTEN
- 10.7 RSTOUT_N output pin characteristics
- 10.8 Input/output characteristics for pin P70_IRQ
- 10.9 Input/output pin characteristics for P30 / UART_RX, P31 / UART_TX, P32_INT0, P33_INT1
- 10.10 Input/output pin characteristics for P35
- 10.11 Input/output pin characteristics for DP and DM
- 10.12 Input pin characteristics for SCL
- 10.13 Input/output pin characteristics for SDA
- 10.14 Output pin characteristics for DELATT
- 10.15 Input pin characteristics for SIGIN
- 10.16 Output pin characteristics for SIGOUT
- 10.17 Input/output pin characteristics for P34
- 10.18 Output pin characteristics for LOADMOD
- 10.19 Input pin characteristics for RX
- 10.20 Output pin characteristics for AUX1/AUX2
- 10.21 Output pin characteristics for TX1/TX2
- 10.22 System reset timing
- 10.23 Timing for the I2C-bus interface
- 10.24 Temperature sensor
- 11. Application information
- 12. Abbreviations
- 13. Revision history
- 14. Legal information
- 15. Contact information
- 16. Tables
- 17. Figures
- 18. Contents

PR533_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.6 — 27 October 2014
206436 11 of 36
NXP Semiconductors
PR533
USB NFC integrated reader solution
10.3 Typical 27.12 MHz Crystal requirements
10.4 Pin characteristics for 27.12 MHz XTAL Oscillator (OSCIN, OSCOUT)
[1]
n(th)
and f
n(th)
define the mask for maximum acceptable phase noise of the clock signal at the OSCIN, OSCOUT inputs. See Figure 3
“27.12 MHz input clock phase noise spectrum mask”.
Table 10. Crystal requirements
Symbol Parameter Conditions Min Typ Max Unit
f
xtal
crystal frequency 27.107 27.12 27.133 MHz
ESR equivalent series resistance - - 100
C
L
load capacitance - 10 - pF
P
xtal
crystal power dissipation 100 - - W
Table 11. Pin characteristics for 27.12 MHz XTAL Oscillator (OSCIN, OSCOUT)
Symbol Parameter Conditions Min Typ Max Unit
I
LI
input leakage current RSTPD_N = 0 V 1-+1mA
V
IH
HIGH-level input voltage 0.7 V
DDA
-V
DDA
V
V
IL
LOW-level input voltage 0 - 0.3 V
DDA
V
V
OH
HIGH-level output voltage - 1.1 - V
V
OL
LOW-level output voltage - 0.2 - V
f
clk
clock frequency 0.05 % 27.12 +0.05 % MHz
duty cycle 40 50 60 %
n(th)
phase noise threshold
[1]
--140 dBc/Hz
f
n(th)
phase noise threshold fre-
quency
n(th)
= 140dBc/Hz;
20dB/decade slope
[1]
- - 50 kHz
OSCIN
V
i
input voltage DC - 0.65 - V
C
i
input capacitance V
DDA
= 2.8 V; V
i
(DC) = 0.65 V;
V
i
(AC) = 1 V p-p
-2-pF
OSCOUT
C
i
input capacitance - 2 - pF
Fig 3. 27.12 MHz input clock phase noise spectrum mask
φ
n(th)
phase noise
(dBc/Hz)
-20 dB/decade
acceptable phase
noise area
001aao393
f
φn(th)
frequency (Hz)