User's Manual
Table Of Contents
- 1 Introduction
- Table of Contents
- 2 Description (continued)
- 3 Physical Characteristics
- 4 ELECTRICAL SPECIFICATIONS
- 5 System Description
- 5.1 Power Supplies
- 5.2 Receiver – Analog Section
- 5.3 Register Descriptions
- 5.4 Direct Commands From MCU to Reader
- 5.4.1 Command Codes
- 5.4.2 Reset
- 5.4.3 Transmission With CRC
- 5.4.4 Transmission Without CRC
- 5.4.5 Delayed Transmission With CRC
- 5.4.6 Delayed Transmission Without CRC
- 5.4.7 Transmission Next Slot
- 5.4.8 Receiver Gain Adjust
- 5.4.9 Test External RF (RSSI at RX input with TX OFF)
- 5.4.10 Test Internal RF (RSSI at RX input with TX ON)
- 5.4.11 Block Receiver
- 5.4.12 Enable Receiver
- 5.5 Reader Communication Interface
- 5.6 Parallel Interface Communication
- 5.7 Serial Interface Communication
- 5.8 External Power Amplifier Application
TRF7960
TRF7961
www.ti.com
SLOU186F–AUGUST 2006–REVISED AUGUST 2010
4 ELECTRICAL SPECIFICATIONS
4.1 ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
VIN Supply voltage 6 V
I
O
Output current 150 mA
Continuous power dissipation See Dissipation Ratings Table
Maximum junction temperature, any condition
(2)
140 °C
T
J
Maximum junction temperature, continuous operation, long-term reliability
(2)
125 °C
T
stg
Storage temperature range –55 to 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
HBM (human body model) 2 kV
ESDS rating CDM (charged device model) 500
V
MM (machine model) 200
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those specified are not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
4.2 DISSIPATION RATINGS TABLE
POWER RATING
(2)
θ
JC
θ
JA
(1)
PACKAGE
(°C/W) (°C/W)
T
A
≤ 25°C T
A
= 85°C
RHB (32) 31 36.4 2.7 W 1.1 W
(1) This data was taken using the JEDEC standard high-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to increase substantially.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and
long-term reliability.
4.3 RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
VIN Supply voltage 2.7 5 5.5 V
T
J
Operating virtual junction temperature range –40 125 °C
T
A
Operating ambient temperature range –40 25 110 °C
Copyright © 2006–2010, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 7
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