User's Manual

apmcomm confidential
apm6658/6659 WiFi 802.11 b/g/n & BT2.1+EDR Dual Radio Module
Product Information Data Sheet
Page 4 of 30
apm Communication, Inc. – TEL: [phone] – FAX: [phone]
Website: http://www.apmcomm.com – E-mail:
[e-mail]
apmcomm Proprietary and Confidential – Product information is subject to change without notice.– May 30 2011
1-10-1 WIFI RF SPECIFICATION................................................................................................................................. 21
1-10-2 BLUETOOTH RF SPECIFICATION ..................................................................................................................... 23
2 SOFTWARE SPECIFICATION.................................................................................................................................25
2-1 WIFI ...................................................................................................................................................................... 25
2-1-1 OS SUPPORT & AVAILABLE DRIVERS................................................................................................................ 25
2-1-2 SECURITY FEATURES SUPPORTED..................................................................................................................... 25
2-1-3 OTHER FEATURES.............................................................................................................................................. 25
2-2 BLUETOOTH SOFTWARE STACKS.......................................................................................................................... 25
2-2-1 HCI STACK ........................................................................................................................................................ 25
2-2-2 HOST SOFTWARE ............................................................................................................................................... 26
3 MECHANICAL SPECIFICATION...........................................................................................................................27
3-1 PACKAGE OUTLINE ............................................................................................................................................... 27
4 ASSEMBLY GUIDELINE ..........................................................................................................................................28
4-1 RECOMMENDED MOUNTING PAD DESIGN (TOP VIEW) .......................................................................................28
4-2 RECOMMENDATION FOR STENCIL APERTURE IN SMT PROCESS........................................................................ 28
4-3 BAKING CONDITION RECOMMENDATION BEFORE IR REFLOW............................................................................ 30
4-4 RECOMMENDATION FOR REFLOW PROFILE ........................................................................................................ 30