User's Manual

apmcomm confidential
apm6658/6659 WiFi 802.11 b/g/n & BT2.1+EDR Dual Radio Module
Product Information Data Sheet
Page 30 of 30
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Website: http://www.apmcomm.com – E-mail:
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apmcomm Proprietary and Confidential – Product information is subject to change without notice.– May 30 2011
4-3 Baking condition recommendation before IR reflow
Baking condition for apm6658/6659 module:
I: 125°C/4 hrs baking is necessary for apm6658/6659 module before SMT process. After baking treatment the
modules can be stored in the environment under 30°C and 60% RH for 48 hrs. If the storage time is over 48 hrs,
the modules need to be re-baked using the same condition again.
II: In the event that the sealed bag is damaged on receipt of the modules, the baking condition should be changed to
125°C/8 hrs.
4-4 Recommendation for Reflow Profile
Maximum reflow temperature is 250°C.
Preheat ramp-up rate
125°C to 180°C
1 to 3°C /sec.
Peak temperature 250°C max.
Temperature maintained above 217°C 30 ~ 90 sec.
Cooling ramp-down rate <2°C/sec.
Maximum number of reflow cycles
≤3
Heating/Cooling Speed Pre-Heating Heating
ΔT1 ΔT2 ΔT3 T
p1
−T
p2
t
pre
T
Max
t
P3
1 to 3°C /sec. 1 to 3°C /sec. < 2°C /sec. 125 ~ 180°C 30 ~ 90 sec. 250°C max. 30 ~ 90 sec.
T
Max
T
p3
T
p2
T
p1
T
Max
Pre-heating
area t
pre
210℃ or more
10~60 sec.
Δ
T
1
Δ
T
2
Δ
T
3
217°C above
30 ~ 90 sec
t
P3
Time