Integration Guide

OEM TD-CDMA PCI Express Module Integration
May 2013 General Dynamics Broadband Proprietary and Confidential Page 2 of 20
Subject to Non Disclosure Agreement
Contents
1 General ................................................................................................................ 4
1.1 Approvals and Dates ............................................................................................................... 4
1.2 Change Record ....................................................................................................................... 4
1.3 Acronyms ................................................................................................................................ 5
1.4 External References ................................................................................................................ 5
2 Introduction .......................................................................................................... 6
2.1 Scope of Document ................................................................................................................. 6
2.2 Overview of Module ................................................................................................................. 6
3 Module Connections ............................................................................................ 7
3.1 PCI Express Mini Interface (J1) .............................................................................................. 7
3.1.1 Universal Serial Bus ........................................................................................................ 7
3.1.2 SIM Interface ................................................................................................................... 7
3.1.3 Co-existence Pins ........................................................................................................... 7
3.2 RF Connections ....................................................................................................................... 7
3.3 DC Power ................................................................................................................................ 7
3.4 Management of Radio Receiver Self-Interference .................................................................. 8
3.4.1 PCB Level ........................................................................................................................ 8
3.4.2 Unit Level ......................................................................................................................... 9
3.4.3 Connecting Cables .......................................................................................................... 9
3.4.4 System Level ................................................................................................................... 9
3.4.5 Provision for “Production Modifications” of Host Equipment ......................................... 10
4 Mechanical ........................................................................................................ 11
4.1 Thermal Management ........................................................................................................... 12
4.1.1 PEM Thermal Specification ........................................................................................... 12
4.1.2 PEM and TD-CDMA Adaptor Thermal Specification ..................................................... 13
4.1.3 Physical Thermal Arrangement – PEM and Adaptor ..................................................... 15
4.1.4 PEM and Adaptor Simulated Environment within theoretical enclosure ....................... 16
4.1.5 Recommendations for thermal cooling schemes .......................................................... 17
4.1.6 PEM and Adaptor .......................................................................................................... 17