Integration Guide

OEM TD-CDMA PCI Express Module Integration
May 2013 General Dynamics Broadband Proprietary and Confidential Page 17 of 20
Subject to Non Disclosure Agreement
4.1.5 Recommendations for thermal cooling schemes
This section specifies the recommendations for the installations for the two configurations below.
o PEM and Adaptor Configurations.
o PEM in laptop Configurations.
4.1.6 PEM and Adaptor
This configuration is planned to be within a die-cast enclosure and the following features are
recommended to add to the construction.
- bottom of TD-CDMA PEM Adaptor to casing small as possible gap filled with an thermal
interface material typically 1mm thermal gasket. Examples of interface material.
o T-Global L37-3 or L37-5, thermal conductivity gasket.
 http://www.tglobal.com.tw/en/index.php
o WL Gore CP6000 or CP8000, thermal conductivity gasket.
 http://www.wlgore.com
- Top of PEM Assembly cover add thermal gasket to contact interface to enclosure top cover.
- Orientation of the enclosure vertical.
- Finned externals of the enclosure orientated vertically.
- Mounting of the enclosure in an orientation to encourage convective airflow over fins.
- Mounting to make use of mounting structure.
- Airflow to be encouraged over the surface of the fin as much as possible.
4.1.7 PEM in Laptop
The TD-CDMA PEM has been integrated into two laptops and this has shown that additional thermal
pads are required to be placed between the TD-CDMA PEM and the laptop motherboard to assist the
heat spreading in these host units.