Integration Guide

OEM TD-CDMA PCI Express Module Integration
May 2013 General Dynamics Broadband Proprietary and Confidential Page 16 of 20
Subject to Non Disclosure Agreement
4.1.4 PEM and Adaptor Simulated Environment within theoretical enclosure
The PEM and Adaptor has been thermally simulated with the following sectioned enclosure to maintain
a maximum 20°C temperature rise above ambient, i.e. max 90°C ambient.
Figure 8: PEM and Adapter Thermal Assembly Structure Section
Thermal Interface gasket material
between bottom of Adaptor PCBA
and enclosure bottom wall
Enclosure Wall
- aluminium
– bottom
Enclosure Wall
- aluminium
– top
Thermal Interface gasket material
between top of PEM unit and
enclosure top wall