Integration Guide

OEM TD-CDMA PCI Express Module Integration
May 2013 General Dynamics Broadband Proprietary and Confidential Page 12 of 20
Subject to Non Disclosure Agreement
4.1 Thermal Management
The General Dynamics Broadband TD-CDMA PCI Express Mini module integration shall be in
accordance with the PCISIG thermal requirements.
This section describes the thermal specifications for the General Dynamics Broadband TD-CDMA PCI
Express Mini Card plus Adaptor and provides recommendations for thermal cooling schemes within
the two configurations and covers the following:
4.1.1 PEM Thermal Specification
Parameter
Rating
Comments
Power Dissipation:
3.1 Watts
@ 3.3VDC
Ambient Air Specification:
-30°C to +70°C
PCI Standard 1.2 -30C to +65C
Maximum Temperature Rise
+25°C
PEM PCB Construction
10 Layer ½ oz copper
Table 1: PEM Thermal Specification
Figure 4: PEM Unit Assembly - Top