User's Manual

PXS8 Hardware Interface Description
2.1 Key Features at a Glance
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PXS8_HD_v03.000 Page 18 of 41 2012-11-30
Confidential / Preliminary
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Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development
equipment.
Antenna 50Ohms. GSM/UMTS/CDMA main antenna, UMTS/CDMA diversity
antenna, GNSS antenna (active/passive)
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
Serial interface ASC0:
• 8-wire modem interface with status and control lines, unbalanced,
asynchronous
• Adjustable baud rates from 9,600bps up to 921,600bps
• Supports RTS0/CTS0 hardware flow control
• Multiplex ability according to GSM 07.10 Multiplexer Protocol
UICC interface Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Status Signal line to indicate network connectivity state
Audio 1 analog interface with microphone feeding
1 digital interface: PCM or I
2
S
Power on/off, Reset
Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature or voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency-off Emergency-off by hardware signal EMERG_OFF if IGT is not active
Special Features
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Antenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx diversity (receiver type 3i - 16-QAM)
Over-the-air provisioning Verizon specific OTASP (Over-the-Air Service Provisioning) and OTAPA
(Over-the-Air Parameter Administration)
Evaluation kit
Evaluation module PXS8 module soldered onto a dedicated PCB that can be connected to
an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Cinterion Wireless Modules and provide a sample configuration for appli-
cation engineering. A special adapter is required to connect the PXS8
evaluation module to the DSB75.
Feature Implementation