Cinterion® PLS8-US R3 Hardware Interface Overview Version: 03.012 DocId: PLS8-USR3_HIO_v03.012 M2M.GEMALTO.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 2 of 41 2 Document Name: Cinterion® PLS8-US R3 Hardware Interface Overview Version: 03.012 Date: 2015-10-13 DocId: PLS8-USR3_HIO_v03.012 Status Confidential / Released GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 3 of 41 Contents 41 Contents 0 Document History ....................................................................................................... 6 1 Introduction ................................................................................................................. 7 1.1 Supported Products ........................................................................................... 7 1.2 Related Documents ...........................
Cinterion® PLS8-US R3 Hardware Interface Overview Page 4 of 41 Tables 41 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Directives ....................................................................................................... Standards of North American type approval .................................................. Standards of European type approval............................................................
Cinterion® PLS8-US R3 Hardware Interface Overview Page 5 of 41 Figures 41 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: PLS8-US R3 system overview ....................................................................... Decoupling capacitor(s) for BATT+................................................................ USB circuit ...........................................................................................
Cinterion® PLS8-US R3 Hardware Interface Overview Page 6 of 41 0 Document History 6 0 Document History New document: "Cinterion® PLS8-US R3 Hardware Interface Overview" v03.012 Chapter What is new --- Initial document setup. PLS8-USR3_HIO_v03.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 7 of 41 1 Introduction 14 1 Introduction The document1 describes the hardware of the Cinterion® PLS8-US R3 module, designed to connect to a cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 8 of 41 1.3 Terms and Abbreviations 14 Abbreviation Description EDGE Enhanced Data rates for GSM Evolution EFR Enhanced Full Rate EGSM Extended GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard ETSI European Telecommunications Standards Institute FCC Federal Communications Commission (U.S.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 9 of 41 1.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 10 of 41 1.4 Regulatory and Type Approval Information 14 1.4 Regulatory and Type Approval Information 1.4.1 Directives and Standards PLS8-US R3 has been designed to comply with the directives and standards listed below.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 11 of 41 1.4 Regulatory and Type Approval Information 14 Table 3: Standards of European type approval ETSI EN 301 489-03 V1.6.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Specific requirements for Short-Range Devices (SRD) operating on frequencies between 9 kHz and 25 GHz ETSI EN 301 489-07 V1.3.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 12 of 41 1.4 Regulatory and Type Approval Information 14 Table 5: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
Cinterion® PLS8-US R3 Hardware Interface Overview Page 13 of 41 1.4 Regulatory and Type Approval Information 14 1.4.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 14 of 41 1.4 Regulatory and Type Approval Information 14 1.4.3 SELV Requirements The power supply connected to the PLS8-US R3 module shall be in compliance with the SELV requirements defined in EN 60950-1. 1.4.4 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLS8-US R3.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 15 of 41 2 Product Concept 18 2 Product Concept 2.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 16 of 41 2.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 17 of 41 2.1 Key Features at a Glance 18 Feature Implementation Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna, (active/passive) GNSS antenna USB USB 2.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 18 of 41 2.2 PLS8-US R3 System Overview 18 2.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 19 of 41 3 Application Interface 27 3 Application Interface PLS8-US R3 is equipped with an SMT application interface (LGA pads) that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • • • • • • • • Operating modes - see Section 3.1 Power supply - see Section 3.2 Serial interface USB - see Section 3.3 Serial interface ASC0 - Section 3.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 20 of 41 3.1 Operating Modes 27 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Mode Function Normal GSM / GPRS / operation UMTS / HSPA / LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is detached and no active communication via ASC0.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 21 of 41 3.2 Power Supply 27 3.2 Power Supply PLS8-US R3 needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+_RF with 2 lines for the RF power amplifier supply • BATT+ with 2 lines for the general power management.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 22 of 41 3.3 USB Interface 27 3.3 USB Interface PLS8-US R3 supports a USB 2.0 High Speed (480Mbps) device interface. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 23 of 41 3.4 Serial Interface ASC0 27 3.4 Serial Interface ASC0 PLS8-US R3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). PLS8-US R3 is designed for use as a DCE.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 24 of 41 3.5 UICC/SIM/USIM Interface 27 3.5 UICC/SIM/USIM Interface PLS8-US R3 has two integrated UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the SIM two interfaces. The UICC/SIM/USIM interfaces support 3V and 1.8V SIM cards.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 25 of 41 3.5 UICC/SIM/USIM Interface 27 open: Card removed closed: Card inserted SMT application interface CCIN1 Module CCRST1 1nF SIM / UICC CCCLK1 GND CCIO1 CCVCC1 220nF Figure 5: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLS8-US R3 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 26 of 41 3.6 Digital Audio Interface 27 3.6 Digital Audio Interface PLS8-US R3 supports a digital audio interface that can be employed either as pulse code modulation interface or as inter IC sound interface. Operation of these interface variants is mutually exclusive, and can be configured by AT command (see [1]). Default setting is pulse code modulation. 3.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 27 of 41 4 GNSS Receiver 27 4 GNSS Receiver PLS8-US R3 integrates a GNSS receiver that offers the full performance of GPS/GLONASS technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via USB or ASC0 interface.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 28 of 41 5 Antenna Interfaces 31 5 Antenna Interfaces 5.1 GSM/UMTS/LTE Antenna Interface The PLS8-US R3 GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1. The interface has an impedance of 50. PLS8-US R3 is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 29 of 41 5.1 GSM/UMTS/LTE Antenna Interface 31 5.1.1 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and their neighboring ground pads directly to the application’s PCB. The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application’ PCB.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 30 of 41 5.2 GNSS Antenna Interface 31 5.2 GNSS Antenna Interface In addition to the RF antenna interface PLS8-US R3 also has a GNSS antenna interface. The GNSS pad itself is the same as for the RF antenna interface (see Section 5.1.1). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM and GNSS is implemented.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 31 of 41 5.2 GNSS Antenna Interface 31 Figure 8 shows sample circuits realizing ESD protection for a passive GNSS antenna. Module SMT interface VGNSS 100nF Not used ANT_GNSS_DC (Optional) 0R ESD protection Passive GNSS antenna 10nH ANT_GNSS To GNSS receiver Figure 8: ESD protection for passive GNSS antenna PLS8-USR3_HIO_v03.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 32 of 41 6 Mechanics, Mounting and Packaging 33 6 Mechanics, Mounting and Packaging 6.1 Mechanical Dimensions of PLS8-US R3 Figure 9 shows a 3D view1 of PLS8-US R3 and provides an overview of the board's mechanical dimensions. For further details see Figure 10. Length: 33mm Width: 29mm Height: 2.2mm Top view Bottom view Figure 9: PLS8-US R3 – top and bottom view 1. The coloring of the 3D view does not reflect the module’s real color.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 33 of 41 6.1 Mechanical Dimensions of PLS8-US R3 33 Internal use; Not to be soldered Figure 10: Dimensions of PLS8-US R3 (all dimensions in mm) PLS8-USR3_HIO_v03.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 34 of 41 7 Sample Application 35 7 Sample Application Figure 11 shows a typical example of how to integrate an PLS8-US R3 module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLS8-US R3 module is active, high level notifies the Power Down mode.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 35 of 41 7 Sample Application 35 ALS3 Current limiter <60mA Figure 11: PLS8-US R3 sample application PLS8-USR3_HIO_v03.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 36 of 41 8 Reference Approval 38 8 Reference Approval 8.1 Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve PLS8-US R3 is shown in Figure 12. The module (i.e., the evaluation module) is connected to the DSB75 by means of a flex cable and a special DSB75 adapter. The GSM/UMTS/LTE test equipment is connected via edge mount SMA connectors soldered to the module’s antenna pads.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 37 of 41 8.2 Compliance with FCC and IC Rules and Regulations 38 8.2 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 8.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 38 of 41 8.2 Compliance with FCC and IC Rules and Regulations 38 Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 39 of 41 9 Appendix 40 9 Appendix 9.
Cinterion® PLS8-US R3 Hardware Interface Overview Page 40 of 41 9.1 List of Parts and Accessories 40 Table 12: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual revenues of €2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees operate out of 99 offices, 34 personalization and data centers, and 24 research and software development centers located in 46 countries. Gemalto develops secure embedded software and secure products which we design and personalize.
