User's Manual

Cinterion
®
PLAS9-X Hardware Interface Overview
6.3 Terms and Abbreviations
36
 PLAS9-X_HIO_v00.044 2017-09-19
Confidential / Preliminary
Page 34 of 39
ETSI European Telecommunications Standards Institute
FCC Federal Communications Commission (U.S.)
FDD Frequency Division Duplex
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HSDPA High Speed Downlink Packet Access
I/O Input/Output
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
LGA Land Grid Array
LTE Long term evolution
MBB Moisture barrier bag
Mbps Mbits per second
MCS Modulation and Coding Scheme
MFBI Multiple Frequency Band Indicator
MIMO Multiple Input Multiple Output
MLCC Multi Layer Ceramic Capacitor
MO Mobile Originated
MS Mobile Station, also referred to as TE
MSL Moisture Sensitivity Level
MT Mobile Terminated
nc Not connected
NTC Negative Temperature Coefficient
PCB Printed Circuit Board
PCL Power Control Level
PCS Personal Communication System, also referred to as GSM 1900
PD Pull Down resistor
PDU Protocol Data Unit
PS Packet Switched
PSK Phase Shift Keying
PU Pull Up resistor
QAM Quadrature Amplitude Modulation
Abbreviation Description