User's Manual

Cinterion
®
PLAS9-X Hardware Interface Overview
2.2 GSM/UMTS/LTE Antenna Interface
22
 PLAS9-X_HIO_v00.044 2017-09-19
Confidential / Preliminary
Page 20 of 39
Figure 8 shows a further sample connection of an evaluation module‘s antenna pad at the bot-
tom layer of the PLAS9-X evaluation module PCB with the PCB‘s coaxial antenna connector.
The PLAS9-X evaluation module is part of the reference equipment used by Gemalto M2M for
type approval (see also Section 5.3).
Figure 8: Routing to PLAS9-X evaluation module‘s RF connector
e.g.
Ant_
WGSM
G N D
G N D
Ground Connection
Stripline (50 ohms) on top
layer of evaluation board from
antenna pad to module edge
Width = 0,40 mm
G N DG N D
G N D G N D
Edge of Module PCB
E.g. U.FL
antennaconnector
50 ohms micro stripline