User's Manual

Cinterion
®
PLAS9-X Hardware Interface Overview
2.1 Application Interface
22
 PLAS9-X_HIO_v00.044 2017-09-19
Confidential / Preliminary
Page 12 of 39
Figure 3: First UICC/SIM/USIM interface
The total cable length between the SMT application interface pads on PLAS9-X and the pads
of the external SIM card holder must not exceed 100mm in order to meet the specifications of
3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both
lines are not placed closely next to each other. A useful approach is using the GND line to
shield the CCIOx line from the CCCLKx line.
Note: Figure 3 shows how to connect a SIM card holder to the first SIM interface. With the sec-
ond SIM interface some internally integrated components on the SIM circuit will have to be ex-
ternally integrated as shown for the second SIM interface in Figure 4. The external components
at CCIN2 should be populated as close as possible to the signal‘s SMT pad
Figure 4: Second UICC/SIM/USIM interface
Module
open: Card removed
closed: Card inserted
CCRST1
CCVCC1
CCIO1
CCCLK1
CCIN1
SIM /
UICC
1n
220n
SMT application interface
GND
Module
Open: Card removed
Closed: Card inserted
CCRST2
CCVCC2
CCIO2
CCCLK2
CCIN2
SIM /
UICC
1nF
220nF
SMT application interface
GND
VEXT
100pF
22k
2k2
10k