Cinterion® PLAS9-X Hardware Interface Overview Version: DocId: 00.044 PLAS9-X_HIO_v00.044 M2M.GEMALTO.
Cinterion® PLAS9-X Hardware Interface Overview Page 2 of 39 2 Document Name: Cinterion® PLAS9-X Hardware Interface Overview Version: 00.044 Date: 2017-09-19 DocId: PLAS9-X_HIO_v00.044 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS.
Cinterion® PLAS9-X Hardware Interface Overview Page 3 of 39 Contents 39 Contents 1 Introduction ................................................................................................................. 6 1.1 Key Features at a Glance .................................................................................. 6 1.2 PLAS9-X System Overview ............................................................................... 9 2 Interface Characteristics ..........................................
Cinterion® PLAS9-X Hardware Interface Overview Page 4 of 39 Tables 39 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Signals of the SIM interface (SMT application interface) ............................... Return loss in the active band........................................................................ Overview of operating modes ........................................................................ Directives .............
Cinterion® PLAS9-X Hardware Interface Overview Page 5 of 39 Figures 39 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: PLAS9-X system overview............................................................................... 9 USB circuit ..................................................................................................... 10 First UICC/SIM/USIM interface ........................................
Cinterion® PLAS9-X Hardware Interface Overview Page 6 of 39 1 Introduction 9 1 Introduction This document1 describes the hardware of the Cinterion® PLAS9-X module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® PLAS9-X Hardware Interface Overview Page 7 of 39 1.
Cinterion® PLAS9-X Hardware Interface Overview Page 8 of 39 1.1 Key Features at a Glance 9 Feature Implementation Firmware update Generic update from host application over USB 2.0 High Speed device interface Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket.
Cinterion® PLAS9-X Hardware Interface Overview Page 9 of 39 1.2 PLAS9-X System Overview 9 1.2 PLAS9-X System Overview GSM/UMTS/LTE Antenna diversity 1 2 Antenna diagnostic Application Antenna switch 2x GPIO GSM/UMTS/LTE 2x ADC Module GPIO ADC SIM card Host application Power supply UICC SIM card Power indication (PWR_IND) RING0 Power for application (VEXT) USB IGT, Emergency Off On/Off Figure 1: PLAS9-X system overview PLAS9-X_HIO_v00.
Cinterion® PLAS9-X Hardware Interface Overview Page 10 of 39 2 Interface Characteristics 22 2 Interface Characteristics PLAS9-X is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface PLAS9-X supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.
Cinterion® PLAS9-X Hardware Interface Overview Page 11 of 39 2.1 Application Interface 22 2.1.2 UICC/SIM/USIM Interface PLAS9-X has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
Cinterion® PLAS9-X Hardware Interface Overview Page 12 of 39 2.1 Application Interface 22 open: Card removed closed: Card inserted SMT application interface CCIN1 Module CCRST1 SIM / UICC 1n CCCLK1 GND CCIO1 CCVCC1 220n Figure 3: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLAS9-X and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® PLAS9-X Hardware Interface Overview Page 13 of 39 2.1 Application Interface 22 2.1.3 Analog-to-Digital Converter (ADC) PLAS9-X provides two unbalanced ADC input lines: ADC1_IN and ADC2_IN. They can be used to measure two independent, externally connected DC voltages in the range of 0.05V to VBATT+. 2.1.4 GPIO Interface PLAS9-X has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. GPIO1...
Cinterion® PLAS9-X Hardware Interface Overview Page 14 of 39 2.1 Application Interface 22 2.1.5 2.1.5.1 Control Signals PWR_IND Signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required. 2.1.5.2 Behavior of the RING0 Line The RING0 line serves to indicate URCs (Unsolicited Result Code).
Cinterion® PLAS9-X Hardware Interface Overview Page 15 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2 GSM/UMTS/LTE Antenna Interface The PLAS9-X GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1. The interface has an impedance of 50. PLAS9-X is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power.
Cinterion® PLAS9-X Hardware Interface Overview Page 16 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and their neighboring ground pads directly to the application’s PCB. The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application’ PCB.
Cinterion® PLAS9-X Hardware Interface Overview Page 17 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2.2 2.2.2.1 RF Line Routing Design Line Arrangement Instructions Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Cinterion® PLAS9-X Hardware Interface Overview Page 18 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 6: Micro-Stripline line arrangement samples PLAS9-X_HIO_v00.
Cinterion® PLAS9-X Hardware Interface Overview Page 19 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2.2.2 Routing Examples Interface to RF Connector Figure 7 shows a sample connection of a module‘s antenna pad at the bottom layer of the module PCB with an application PCB‘s coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.
Cinterion® PLAS9-X Hardware Interface Overview Page 20 of 39 2.2 GSM/UMTS/LTE Antenna Interface 22 Figure 8 shows a further sample connection of an evaluation module‘s antenna pad at the bottom layer of the PLAS9-X evaluation module PCB with the PCB‘s coaxial antenna connector. The PLAS9-X evaluation module is part of the reference equipment used by Gemalto M2M for type approval (see also Section 5.3). GND e.g.
Cinterion® PLAS9-X Hardware Interface Overview Page 21 of 39 2.3 Sample Application 22 2.3 Sample Application Figure 9 shows a typical example of how to integrate an PLAS9-X module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLAS9-X module is active, high level notifies the Power Down mode.
Cinterion® PLAS9-X Hardware Interface Overview Page 22 of 39 2.3 Sample Application 22 Figure 9: PLAS9-X sample application PLAS9-X_HIO_v00.
Cinterion® PLAS9-X Hardware Interface Overview Page 23 of 39 3 Operating Characteristics 24 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 3: Overview of operating modes Mode Function Normal GSM / GPRS / operation UMTS / HSPA / LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is detached.
Cinterion® PLAS9-X Hardware Interface Overview Page 24 of 39 3.2 Power Supply 24 3.2 Power Supply PLAS9-X needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+_RF with 2 lines for the RF power amplifier supply • BATT+ with 2 lines for the general power management.
Cinterion® PLAS9-X Hardware Interface Overview Page 25 of 39 4 Mechanical Dimensions 26 4 Mechanical Dimensions 4.1 Mechanical Dimensions of PLAS9-X Figure 11 shows a 3D view1 of PLAS9-X and provides an overview of the board's mechanical dimensions. For further details see Figure 12. Length: 40mm Width: 32mm Height: 2.8mm Top view Bottom view Figure 11: PLAS9-X – top and bottom view 1. The coloring of the 3D view does not reflect the module’s real color. PLAS9-X_HIO_v00.
Cinterion® PLAS9-X Hardware Interface Overview Page 26 of 39 4.1 Mechanical Dimensions of PLAS9-X 26 Figure 12: Dimensions of PLAS9-X (all dimensions in mm) PLAS9-X_HIO_v00.
Cinterion® PLAS9-X Hardware Interface Overview Page 27 of 39 5 Regulatory and Type Approval Information 32 5 Regulatory and Type Approval Information Note that some regulatory and type approval information is still to be defined. 5.1 Directives and Standards PLAS9-X has been designed to comply with the directives and standards listed below.
Cinterion® PLAS9-X Hardware Interface Overview Page 28 of 39 5.1 Directives and Standards 32 Table 7: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
Cinterion® PLAS9-X Hardware Interface Overview Page 29 of 39 5.2 SAR requirements specific to portable mobiles 32 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® PLAS9-X Hardware Interface Overview Page 30 of 39 5.3 Reference Equipment for Type Approval 32 5.3 Reference Equipment for Type Approval The Gemalto M2M general reference setup submitted to type approve PLAS9-X is shown in the figure below: Figure 13 illustrates the setup for general tests and evaluation purposes. The evaluation module can be plugged directly onto the ALAS6A-DSB75 adapter. The GSM/UMTS/ LTE test equipment is still connected via SMA connectors on the ALAS6A-DSB75 adapter.
Cinterion® PLAS9-X Hardware Interface Overview Page 31 of 39 5.4 Compliance with FCC and IC Rules and Regulations 32 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 5.
Cinterion® PLAS9-X Hardware Interface Overview Page 32 of 39 5.4 Compliance with FCC and IC Rules and Regulations 32 Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Cinterion® PLAS9-X Hardware Interface Overview Page 33 of 39 6 Document Information 36 6 Document Information 6.1 Revision History New document: "Cinterion® PLAS9-X Hardware Interface Overview" Version 00.044 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents PLAS9-X AT Command Set PLAS9-X Release Note Application Note 48: SMT Module Integration Universal Serial Bus Specification Revision 3.0 Universal Serial Bus Specification Revision 2.0 6.
Cinterion® PLAS9-X Hardware Interface Overview Page 34 of 39 6.3 Terms and Abbreviations 36 Abbreviation Description ETSI European Telecommunications Standards Institute FCC Federal Communications Commission (U.S.
Cinterion® PLAS9-X Hardware Interface Overview Page 35 of 39 6.
Cinterion® PLAS9-X Hardware Interface Overview Page 36 of 39 6.4 Safety Precaution Notes 36 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLAS9-X. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
Cinterion® PLAS9-X Hardware Interface Overview Page 37 of 39 7 Appendix 38 7 Appendix 7.1 List of Parts and Accessories Table 10: List of parts and accessories Description Supplier Ordering information PLAS9-X Gemalto M2M Standard module Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N5130-B100 Module label number: L30960-N5130-B100-11 PLAS9-X Evaluation module Gemalto M2M Ordering number: TBD.
Cinterion® PLAS9-X Hardware Interface Overview Page 38 of 39 7.1 List of Parts and Accessories 38 Table 11: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion® modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment.
