User's Manual


PDS6_HIO_v02.800
Confidential / Preliminary
2014-10-27
Cinterion
®
PDS6 Hardware Interface Overview
1.1 Key Features at a Glance
Page 8 of 35
Feature Implementation
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem.
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and provides the possibility to use an optional module mounting
socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application development equipment.
USB
USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
1 serial interface
ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
• Adjustable baud rates: 1,200bps to 921,600bps
• Autobauding: 1,200bps to 230,400bps
• Supports RTS0/CTS0 hardware flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
Audio
1 analog interface (with microphone feeding)
1 di
g
ital interface
(
PCM
)
UICC interface Supported SIM/USIM cards: 3V, 1.8V
GPIO interface 6 GPIOs shared with fast shutdown, pulse counter, and PWM functionality
I
2
C interface Supports I
2
C serial interface
SPI interface Serial peripheral interface
ADC input Analog-to-digital converter for general purpose voltage measurements
Antenna interface pads
50
Power on/off, Reset
Power on/off
Switch-on by hardware signal IGT
Switch-off by AT command
Switch off by hardware signal GPIO4/FST_SHDN instead of AT command
Automatic switch-off in case of critical temperature and voltage conditions
Reset
Orderly shutdown and reset by AT command
Emergency reset by hardware signal EMERG_OFF and IGT
Special features
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Evaluation kit
Evaluation module
PDS6 module soldered onto a dedicated PCB that can be con- nected to an
adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the PDS6 evaluation
module to the DSB75.