User's Manual

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PCS3 Hardware Interface Description
7.2 Mounting PCS3 onto the Application Platform
PCS3_HD_v01.000
Confidential / Preliminary
Page 85 of 101 2013-10-21
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7.2.1.2 Board Level Characterization
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Board level characterization issues should also be taken into account if devising an SMT pro-
cess.
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Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface
mount checks are described in [4].
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It is recommended to characterize land patterns before an actual PCB production, taking
individual processes, materials, equipment, stencil design, and reflow profile into account. For
land
and stencil pattern design recommendations see also Section 7.2.1.1. Optimizing the
solder
stencil pattern design and print process is necessary to ensure print uniformity, to
decrease sol-
der voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to [4].
Generally, solder paste manufacturer recommendations for screen printing process
parameters and reflow profile conditions should be followed. Maximum ratings are described in
Section
7.2.3.
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7.2.2 Moisture Sensitivity Level
PCS3 comprises components that are susceptible to damage induced by absorbed moisture.
Cinterion’s PCS3 module complies with the latest revision of the IPC/JEDEC J-STD-020
standard for moisture sensitive surface mount devices and is classified as MSL 4.
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For additional MSL (=moisture sensitivity level) related information see Section 7.2.4 and Sec-
tion 7.3.2.