User's Manual


PCS3 Hardware Interface Description
7.2 Mounting PCS3 onto the Application Platform
PCS3_HD_v01.000
Confidential / Preliminary
Page 83 of 101 2013-10-21
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7.2 Mounting PCS3 onto the Application Platform
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This section describes how to mount PCS3 onto the PCBs (=printed circuit boards), including
land pattern and stencil design, board-level characterization, soldering conditions, durability
and mechanical handling. For more information on issues related to SMT module integration
see also [4].
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Note: All SMT module pads need to be soldered to the application’s PCB. Not only must all sup-
ply pads and signals be connected appropriately, but all pads denoted as “Do not use“ will also
have to be soldered (but not electrically connected) in order to ensure the best possible me-
chanical stability.
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7.2.1 SMT PCB Assembly
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7.2.1.1 Land Pattern and Stencil
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The land pattern and stencil design as shown below is based on Cinterion characterizations for
lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron-thick stencil.
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The land pattern given in Figure 37 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 6.5). Besides these pads there are ground areas
on the module's bottom side that must not be soldered, e.g., the position marker. To prevent
short circuits, it has to be ensured that there are no wires on the external application side that
may connect to these module ground areas.
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Figure 37: Land pattern (top view)