User's Manual

PCS3_HD_v01.000-03
Confidential / Preliminary
Page 59 of 101
2013-10-21
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PCS3 Hardware Interface Description
6.4 Reliability Characteristics
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6.4 Reliability Characteristics
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The test conditions stated below are an extract of the complete test specifications.
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Table 20: Summary of reliability test conditions
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Type of test Conditions Standard
Vibration Frequency range: 10-20Hz; acceleration: 5g
Frequency range: 20-500Hz; acceleration: 20g
Duration: 20h per axis; 3 axes
DIN IEC 60068-2-6
1
Shock half-sinus
Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 60068-2-27
Dry heat
Temperature: +70 ±2×C
Test duration: 16h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb
ETS 300 019-2-7
Temperature
change (shock)
Low temperature: -40×C ±2×C
High temperature: +85×C ±2×C
Changeover time: < 30s (dual chamber system)
Test duration: 1h
Number of repetitions: 100
DIN IEC 60068-2-14 Na
ETS 300 019-2-7
Damp heat cyclic
High temperature: +55×C ±2×C
Low temperature: +25×C ±2×C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 60068-2-30 Db
ETS 300 019-2-5
Cold (constant
exposure)
Temperature: -40 ±2×C
Test duration: 16h
DIN IEC 60068-2-1
1.
For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was inc-
reased to 20g.
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6.5 Pad Assignment and Signal Description
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The SMT application interface on the PCS3 provides connecting pads to integrate the module
into external applications. The following Table 21 lists the pads’ assignments, Figure 32 (bot-
tom view) and Figure 33 (top view) show the connecting pads’ numbering plan.
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Please note that a number of connecting pads are marked as reserved for future use (rfu) or
ground (GND) and further qualified as either (dnu), (GND) or (nc):
• Pads marked "rfu" and qualified as "dnu" (do not use) may be soldered but should not be
connected to an external application.
• Pads marked "rfu" and qualified as "GND" (ground) are assigned to ground with PCS3 mod-
ules, but may have different assignments with future Cinterion products using the same pad
layout.
• Pads marked "GND" and qualified as "nc" (not connected) are internally not connected with
PCS3 modules but may be soldered and arbitrarily be connected to external ground.
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Because with surface mount modules the heat is transported through the solder pads to the
external application’s PCB, it is generally recommended to solder all pads.
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