PCS3 Version: Document: 01.000-03 PCS3_HD_v01.
PCS3 Hardware Interface Description Document Name: PCS3 Hardware Interface Description Version: 01.000-03 Date: 2013-10-21 Document: PCS3_HD_v01.000-03 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS.
PCS3 Hardware Interface Description Contents Contents 0 Document History ....................................................................................................... 8 1 Introduction .............................................................................................................. 10 1.1 Related Documents ......................................................................................... 10 1.2 Terms and Abbreviations ......................................................
PCS3 Hardware Interface Description Contents 3.10 3.9.2 Inter I2C Interface .............................................................................. 48 Control Signals ................................................................................................ 50 3.10.1 PWR_IND Signal ................................................................................ 50 3.10.2 Network Connectivity Status Signals .................................................. 50 3.10.
PCS3 Hardware Interface Description Contents 6.4 6.3.1.3 Baking ................................................................................ 88 6.3.1.4 Electrostatic Discharge ....................................................... 88 Packaging ....................................................................................................... 89 6.4.1 Tape and Reel .................................................................................... 89 6.4.1.1 Orientation .......................
PCS3 Hardware Interface Description Tables Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Directives ........................................................................................................
PCS3 Hardware Interface Description Figures Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figure 40: Figure 41: Figure 42: Figure
PVS8 Hardware Interface Description 0 Document History 0 Document History New document: "PCS3 Hardware Interface Description" Version 01.000-03 Chapter What is new -- Initial document release PCS3_HD_v01.
PCS3 Hardware Interface Description 1 Introduction 1 Introduction The document1 describes the hardware of the PCS3 module, designed to connect to a cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
PCS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description DSP Digital Signal Processor DTMF Dual Tone Multi Frequency DTX Discontinuous Transmission EFR Enhanced Full Rate EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETSI European Telecommunications Standards Institute EVRC Enhanced Variable Rate Codec FCC Federal Communications Commission (U.S.
PCS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description NTC Negative Temperature Coefficient PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCS Personal Communication System, also referred to as GSM 1900 PD Pull Down resistor (appr. 100k) PDU Protocol Data Unit PS Packet Switched PU Pull Up resistor (appr.
PCS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards PCS3 has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "PCS3 Hardware Interface Description".
PCS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
PCS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information 1.3.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a CDMA module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PCS3 based applications to be evaluated and approved for compliance with national and/or international regulations.
PCS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information 1.3.3 SELV Requirements The power supply connected to the PCS3 module shall be in compliance with the SELV requirements defined in EN 60950-1. 1.3.4 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PCS3.
PCS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
PCS3 Hardware Interface Description 2 Product Concept 2 Product Concept 2.1 Key Features at a Glance Feature Implementation General Frequency bands CDMA: Dual band (BC0/BC1/BC10), 800/1900MHz Power supply 3.3V < VBATT+ < 4.2V Operating temperature (board temperature) Normal operation: -30°C to +85°C Restricted operation: -40°C to +95°C Physical Dimensions: 33mm x 29mm x 2mm Weight: approx.
PCS3 Hardware Interface Description 2.1 Key Features at a Glance Feature Implementation Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [4].
PCS3 Hardware Interface Description 2.2 PCS3 System Overview 2.2 PCS3 System Overview CDMA Main Antenna Application Host Application Controller Analog audio Power supply Digital audio PCM or I2C Codec LCI Low current indication Wakeup Power for Application (VEXT) Power Indication (PWR_IND) Serial ASC0 Host Wakeup USB Modem Interface CDMA Module RTC IGT, Emergency Off Net state/ status or PSU On/Off Application Figure 1: PCS3 system overview PCS3_HD_v01.
PCS3 Hardware Interface Description 2.2 PCS3 System Overview 2.
PCS3 Hardware Interface Description 3 Application Interface 3 Application Interface PCS3 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • • • • • • • • Operating modes - see Section 3.1 Power supply - see Section 3.2 RTC backup - see Section 3.5 Serial interface USB - see Section 3.6 Serial interface ASC0 - Section 3.7 Analog audio interface - see Section 3.
PCS3 Hardware Interface Description 3.1 Operating Modes 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Function CDMA SLEEP Normal operation Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0.
PCS3 Hardware Interface Description 3.2 Power Supply 3.2 Power Supply PCS3 needs to be connected to a power supply at the SMT application interface - 6 lines each BATT+ and GND. There are three separate voltage domains for BATT+: • BATT+_CDMA with 2 lines for the first power amplifier supply • BATT+_CDMA with 2 lines for the second power amplifier supply • BATT+ with 2 lines for the general power management.
PCS3 Hardware Interface Description 3.2 Power Supply 3.2.1 Monitoring Power Supply by AT Command To monitor the supply voltage you can use the AT^SBV command which returns the averaged value related to BATT+ and GND at the SMT application interface. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when PCS3 is in Limited Service (deregistered).
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3 Power-Up / Power-Down Scenarios In general, be sure not to turn on PCS3 while it is beyond the safety limits of voltage and temperature stated in Section 6.1. PCS3 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.3.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.2 Signal States after Startup Table 7 describes the various states each interface signal passes through after startup and during operation. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in defined state.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.3 Turn off PCS3 Using AT Command The best and safest approach to powering down PCS3 is to issue the AT^SMSO command. This procedure lets PCS3 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power Down mode. In this mode, only the RTC stays active. After sending AT^SMSO do not enter any other AT commands.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.4 Configuring the IGT Line for Use as ON/OFF Switch The IGT line can be configured for use in two different switching modes: You can set the IGT line to switch on the module only, or to switch it on and off. The switching mode is determined by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. This approach is useful for application manufacturers who wish to have an ON/OFF switch installed on the host device.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.5 Automatic Shutdown Automatic shutdown takes effect if: • The PCS3 board is exceeding the critical limits of overtemperature or undertemperature • Undervoltage or overvoltage is detected The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO command, i.e. PCS3 logs off from the network and the software enters a secure state avoiding loss of data.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, PCS3 instantly displays an alert (if enabled).
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.5.2 Under voltage Shutdown If the measured battery voltage is no more sufficient to set up a call the following URC will be presented: ^SBC: Under voltage. The URC indicates that the module is close to the under voltage threshold. If under voltage persists the module keeps sending the URC several times before switching off automatically. This type of URC does not need to be activated by the user.
PCS3 Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 3.3.7 Turn off PCS3 in Case of Emergency Caution: Use the EMERG_OFF line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_OFF line causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PCS3 does not respond, if reset or shutdown via AT command fails.
PCS3 Hardware Interface Description 3.4 Power Saving 3.4 Power Saving PCS3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode) in order to minimize its current consumption. The following sections explain the module’s CTS0 behavior and also mention how to wake up from or disable the so-called SLEEP mode. The implementation of the USB host interface also influences the module’s power saving behavior and therefore its current consumption. For more information see Section 3.
PCS3 Hardware Interface Description 3.4 Power Saving 3.4.3 Wake up from or Disabling Power Saving The RTS0 line can be used to wake up the module from its power saving SLEEP mode. RTS0 activation (high to low transition) may be employed to cut short pauses between listening to paging messages. Following an RTS toggle the module will return to SLEEP mode 5 seconds after the last character was sent over the interface.
PCS3 Hardware Interface Description 3.5 RTC Backup 3.5 RTC Backup The internal Real Time Clock of PCS3 is supplied from a separate voltage regulator in the power supply component which is also active when PCS3 is in Power Down mode and BATT+ is available. In addition, you can use the VDDLP line on the SMT interface to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged from the internal LDO of PCS3.
PCS3 Hardware Interface Description 3.6 USB Interface 3.6 USB Interface PCS3 supports a USB 2.0 Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+.
PCS3 Hardware Interface Description 3.6 USB Interface 3.6.1 Reducing Power Consumption While a USB connection is active, the module will never switch into SLEEP Mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power.
PCS3 Hardware Interface Description 3.7 Serial Interface ASC0 3.7 Serial Interface ASC0 PCS3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 22.
PCS3 Hardware Interface Description 3.7 Serial Interface ASC0 Table 9: DCE-DTE wiring of ASC0 V.24 circuit DCE DTE Line function Signal direction Line function Signal direction 103 TXD0 Input TXD Output 104 RXD0 Output RXD Input 105 RTS0 Input RTS Output 106 CTS0 Output CTS Input 108/2 DTR0 Input DTR Output 107 DSR0 Output DSR Input 109 DCD0 Output DCD Input 125 RING0 Output RING Input PCS3_HD_v01.
PCS3 Hardware Interface Description 3.8 Analog Audio Interface 3.8 Analog Audio Interface PCS3 has an analog audio interface with a balanced analog microphone input and a balanced analog earpiece output. A supply voltage and an analog ground connection are provided at dedicated lines. PCS3 offers eight audio modes which can be selected with the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode.
PCS3 Hardware Interface Description 3.8 Analog Audio Interface 3.8.1 Microphone Inputs and Supply The differential microphone inputs MICP and MICN present variable impedances depending on the gain. The microphone inputs must be decoupled by capacitors Ck (typical 1µF). The input stage uses a differential operational amplifier circuit with programmable resistors in the input and the feedback path. The detailed structure of this stage and the following uplink path is shown in Figure 11.
PCS3 Hardware Interface Description 3.8 Analog Audio Interface MICP leads the signal via to the non-inverting input of the operational amplifier which is then connected via to AGND. The gain of the input stage can be programmed by the parameter , A gain stage follows that can be set to 0dB or 24dB using . If 24dB is spec- ified, the common mode rejection ratio is reduced accordingly. Finally, the uplink gain can be scaled in the PCM path by the parameter.
PCS3 Hardware Interface Description 3.8 Analog Audio Interface The following figures show possible microphone and line connections. 470 2k2 VMIC 2k2 1µF MICP + Module 10µF MICN 1µF 5k6 AGND Figure 12: Single ended microphone connection The configuration shown in Figure 12 is suitable for short distances between microphone and module. A typical electric microphone has a metal case connected to its ground pad.
PCS3 Hardware Interface Description 3.8 Analog Audio Interface Line output device 100nF MICP Module ~ MICN -1 100nF Figure 14: Line input Using the line input configuration the output level of the ground related balanced source should be as high as possible to achieve the best SNR. Since the input impedance of PCS3 is quite high at low gains, the coupling capacitances may be smaller. 3.8.2 Loudspeaker Output PCS3 provides a differential loudspeaker output EPP/EPN.
PCS3 Hardware Interface Description 3.9 Digital Audio Interface 3.9 Digital Audio Interface PCS3 supports a digital audio interface that can be employed either as pulse code modulation (see Section 3.9.1) or as inter IC sound interface (see Section 3.9.2). Operation of these interface variants is mutually exclusive. 3.9.1 Pulse Code Modulation Interface (PCM) PCS3’s PCM interface can be used to connect audio devices capable of pulse code modulation.
PCS3 Hardware Interface Description 3.9 Digital Audio Interface Table 12: Overview of PCM signal functions Signal name on SMT application interface Signal configuration inactive1 Signal direction: Master Signal direction: Slave Description PCM_FSC PD O I Frame synchronization signal to/from external codec PCM_CLK PD O I Bit clock to/from external codec 1. Inactive means no call, no tone generation and no external clock mode.
PCS3 Hardware Interface Description 3.9 Digital Audio Interface 3.9.2 I2C Interface PCS3’s I2C compatible interface for FM radio support and Camera I2C_SDA and I2C_SCL: I2C control bus Serial data line of the I2C bus (I2C_SDA) – the standard required pull-up resistor is placed on the QSC device side; a pull-up resistor is not required in the camera module.
PCS3 Hardware Interface Description 3.10 Control Signals 3.10 Control Signals 3.10.1 PWR_IND Signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required. Module SMT interface e.g. BATT+ Power supply On/Off (open drain driver) PWR_IND Figure 21: PWR_IND signal 3.10.
PCS3 Hardware Interface Description 3.10 Control Signals 3.10.3 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface ASC0 (see also Section 3.7). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). Although not mandatory for use in a host application, it is strongly suggested that you connect the RING0 line to an interrupt line of your application.
PCS3 Hardware Interface Description 3.10 Control Signals 3.10.5 Low Current Indicator A low current indication is optionally available over the LC_IND line. By default, low current indication is disabled. For the LC_IND signal to work as a low current indicator the feature has to be enabled by AT command (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). If enabled, the LC_IND signal is high when the module is sleeping. During its sleep the module will for the most part be slow clocked with 32kHz RTC.
PCS3 Hardware Interface Description 3.10 Control Signals 3.10.6 RING0 (ASC0), WAKEUP and LCI_IND Startup Behavior Table 24 shows the startup behavior of the control lines described in the above sections.
PCS3 Hardware Interface Description 5 Antenna Interfaces Configuration 1) "local" (P) AT^SCFG="URC/Ringline", "asc0" "off" "wakeup" Configuration "0" "1" (P) AT^SCFG= "2" "URC/Ringline/ActiveTime", "keep" 2) Wakeup State RING0 WAKEUP Pull down (appr. 100k) iven high driven low dashed line: lternative funtion low (active) low (PD) low (active) low (PD) high low (PD) high high (active) Wakeup Active Time for RING0, WAKEUP 4.
PCS3 Hardware Interface Description 5.1 CDMA Antenna Interface 5.1.1 Antenna Installation The antenna is connected by soldering the antenna pads and their neighboring ground pads directly to the application’s PCB.
PCS3 Hardware Interface Description 5.1 CDMA Antenna Interface 5.1.2 5.1.2.1 RF Line Routing Design Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
PCS3 Hardware Interface Description 5.1 CDMA Antenna Interface Differential coated coplanar strips with ground This section gives two line arrangement examples for differential coated coplanar strip with ground Figure 27: differential coated coplanar strip with ground PCS3_HD_v01.
PCS3 Hardware Interface Description 5.1 CDMA Antenna Interface 5.1.2.2 Routing Example Interface to RF Connector Figure 28 shows a sample connection of a module‘s antenna pad at the bottom layer of the module PCB with an application PCB‘s coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.
PCS3 Hardware Interface Description 6 Electrical, Reliability and Radio Characteristics 6 Electrical, Reliability and Radio Characteristics 6.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 17 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PCS3. Table 17: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+ -0.5 +4.2 V Voltage at all digital lines in POWER DOWN mode -0.3 +0.
PCS3 Hardware Interface Description 6.2 Operating Temperatures 6.2 Operating Temperatures Table 18: Board temperature Parameter Operating temperature range 1 Min Typ Max Unit -30 +25 +85 °C +95 °C >+95 °C Restricted temperature range -40 Automatic shutdown2 Temperature measured on PCS3 board <-40 1. 2. --- Restricted operation allows normal mode speech calls or data transmission for limited time until automatic thermal shutdown takes effect.
PCS3 Hardware Interface Description 6.4 Reliability Characteristics 6.4 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Table 21: Overview: Pad assignments Pad No. Signal Name Pad Signal Name No. Pad No.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Figure 32: PCS3 bottom view: Pad assignments PCS3_HD_v01.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Please note that the reference voltages listed in Table 22 are the values measured directly on the PCS3 module. They do not apply to the accessories connected. Table 22: Signal description Function Signal name IO Signal form and level Comment Power supply BATT+_CDMA BATT+_CDMA I VImax = 4.2V VInorm = 3.8V VImin = 3.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Table 22: Signal description Function Signal name IO Signal form and level RTC Back up VDDLP O VOmax = 3.20V while BATT+ =>3.3V If unused keep line open. RI = 1.8k To employ the SMPL feaVI = 1.5V…3.25V at Imax= 10µA while ture the VDDLP line has to BATT+ = 0V supplied for at least 2 seconds after a possible power loss (e.g., by connecting a 10µF capacitor). See also Section 3.3.6.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Table 22: Signal description Function Signal name Pulse Code PCM_IN Modulation PCM_CLK (PCM) PCM_FSC Inter IC interface (I2C) Power Indicator IO Signal form and level I PCM_OUT VILmax = 0.6V at 30µA V min = 1.20V at -30µA I/O VIHmax = 2V IH I/O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA O VOHmax = 1.85V I2CDAT O I2CCLK O PWR_IND O Comment In Master mode PCM_FSC and PCM_CLK are output signals1.
PCS3 Hardware Interface Description 6.5 Pad Assignment and Signal Description Table 22: Signal description Function Signal name IO Signal form and level Comment Low Current Indication LC_IND O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V If the function is enabled (see Section 3.10.5)1. I VIHmax = 2V RPD= appr. 100kOhm If the function is disabled (see Section 3.10.5)1. 1. Signal state if not configured: I, PD (appr. 100k) PCS3_HD_v01.
PCS3 Hardware Interface Description 6.6 Power Supply Ratings 6.6 Power Supply Ratings Table 23: Power supply ratings Description BATT+ Supply voltage Conditions Min Typ Max Unit Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes 3.3 4.2 V 400 mV 20 16 mVpp mVpp 3.
PCS3 Hardware Interface Description 6.7 Electrical Characteristics of the Voiceband Part 6.7 Electrical Characteristics of the Voiceband Part 6.7.1 Setting Audio Parameters by AT Commands Audio mode 1 is the basic audio mode optimized for the Votronic reference handset (see Section 10.1). The default parameters are determined for type approval and are not adjustable with AT commands. The audio modes 2 to 8 can be temporarily adjusted according to the AT command parameters listed in the table below.
PCS3 Hardware Interface Description 6.7 Electrical Characteristics of the Voiceband Part 6.7.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying AT command parameters: AT^SNFI allows to set the parameters , and, whereas the parameters , and can be adjusted with AT^SNFO. For more information on the AT commands and parameters see Section 6.7.1 and [1].
PCS3 Hardware Interface Description 6.7 Electrical Characteristics of the Voiceband Part 6.7.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with AT command. All values are noted for default gains, e.g. the default parameters are left unchanged. Table 25: Voiceband characteristics Audio mode no.
PCS3 Hardware Interface Description 6.7 Electrical Characteristics of the Voiceband Part Table 25: Voiceband characteristics Audio mode no. AT^SNFS= 11 2 3 4 5 6 MIC input signal for 0dBm0, 2 f = 1024 Hz 15mV 650mV EP output signal in mV rms. @ 0dBm0, 1024 Hz, no load (default gain) / @ 3.14 dBm0 465mV 2.1Vpp 512mV 2.1Vpp 465mV 2.1Vpp 370mV 1.6Vpp 1485mV 5.7Vpp 1290mV 5.5Vpp Sidetone gain at default settings -16.5dB 0dB -24dB 15mV 12mV -16.
PCS3 Hardware Interface Description 6.7 Electrical Characteristics of the Voiceband Part 6.7.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 1024Hz using AT^SNFO=57,33,0 in audio mode 6 during a voice call unless otherwise stated. Table 26: Voiceband receive path Parameter Min Typ Max Unit Test condition / remark Maximum differential output voltage (peak to peak) EPP to EPN 4.5 5.0 V V 32 , No load, @ 3.
6.8 RF Antenna Interface Characteristics Table 28: RF Antenna interface CDMA Parameter Conditions CDMA connectivity BC0, BC1,BC10 Receiver Input Sensitivity @ ARP CDMA BC0 1xRTT -108.5 -110 dBm CDMA BC1 1xRTT -107.5 -108.5 dBm CDMA BC10 1xRTT -108.5 -110 dBm CDMA BC0 1xRTT +21 +21 +24 +24 +25 +25 dBm CDMA BC1 1xRTT +21 +21 +24 +24 +25 +25 dBm +21 +21 +24 +24 +25 +25 dBm RF Power@ ARP with 50Ohm Load Min. CDMA BC10 PCS3_HD_v01.
PCS3 Hardware Interface Description 6.10 Electrostatic Discharge 6.9 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PCS3 module.
PCS3 Hardware Interface Description 7 Mechanics, Mounting and Packaging 7 Mechanics, Mounting and Packaging 7.1 Mechanical Dimensions of PCS3 Figure 35 shows a 3D view1 of PCS3 and provides an overview of the board's mechanical dimensions. For further details see Figure 36. Length: 33mm Width: 29mm Height: 2mm Top view Bottom view Figure 35: PCS3 – top and bottom view 1. The coloring of the 3D view does not reflect the module’s real color. PCS3_HD_v01.
PCS3 Hardware Interface Description 7.1 Mechanical Dimensions of PCS3 Position marker Internal use; Not to be soldered Figure 36: Dimensions of PCS3 (all dimensions in mm) PCS3_HD_v01.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform 7.2 Mounting PCS3 onto the Application Platform This section describes how to mount PCS3 onto the PCBs (=printed circuit boards), including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [4]. Note: All SMT module pads need to be soldered to the application’s PCB.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform The stencil design illustrated in Figure 38 and Figure 39 is recommended by Cinterion as a result of extensive tests with Cinterion Daisy Chain modules. Figure 38: Recommended design for 110 micron thick stencil (top view) Figure 39: Recommended design for 150 micron thick stencil (top view) PCS3_HD_v01.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform 7.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform 7.2.3 7.2.3.1 Soldering Conditions and Temperature Reflow Profile Figure 40: Reflow Profile PCS3_HD_v01.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform Table 31: Reflow temperature ratings Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) 150°C 200°C 60-120 seconds Average ramp up rate (TSmax to TP) 3K/second max.
PCS3 Hardware Interface Description 7.2 Mounting PCS3 onto the Application Platform 7.2.4 7.2.4.1 Durability and Mechanical Handling Storage Life PCS3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90%.
PCS3 Hardware Interface Description 7.3 Packaging 7.3 Packaging 7.3.1 Tape and Reel The single-feed tape carrier for PCS3 is illustrated in Figure 41. The figure also shows the proper part orientation. The tape width is 44mm and the PCS3 modules are placed on the tape with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 500 modules. 7.3.1.1 Orientation Figure 41: Carrier tape Figure 42: Roll direction PCS3_HD_v01.
PCS3 Hardware Interface Description 7.3 Packaging 7.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 43: Barcode label on tape reel PCS3_HD_v01.
PCS3 Hardware Interface Description 7.3 Packaging 7.3.2 Shipping Materials PCS3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute PCS3 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card • Transportation bag 7.3.2.
PCS3 Hardware Interface Description 7.3 Packaging Figure 45: Moisture Sensitivity Label PCS3_HD_v01.
PCS3 Hardware Interface Description 7.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the approximate relative humidity level within the bag.
PCS3 Hardware Interface Description 8 Sample Application 8 Sample Application Figure 47 shows a typical example of how to integrate an PCS3 module with an application. The audio interface demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC µC of the microcontroller.
PCS3 Hardware Interface Description 9 Reference Approval 9 Reference Approval 9.1 Reference Equipment for Type Approval The Cinterion Wireless Modules reference setup submitted to type approve PCS3 is shown in Figure 48. The module (i.e., the evaluation module) is connected to the DSB75 by means of a flex cable and a special DSB75 adapter. The CDMA test equipment is connected via edge mount SMA connectors soldered to the module’s antenna pads.
PCS3 Hardware Interface Description 10 Appendix 9.2 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Cinterion Wireless Modules reference application described in Section 9.
PCS3 Hardware Interface Description 10 Appendix Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement." CAN ICES-3(B)/ NMB-3(B) 10 Appendix 10.
PCS3 Hardware Interface Description 10.1 List of Parts and Accessories Table 33: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No.
PCS3 Hardware Interface Description 10.2 Mounting Advice Sheet 10.2 Mounting Advice Sheet To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is soldered flat against the host device (see also Section 7.2). The advice sheet on the next page shows a number of examples for the kind of bending that may lead to mechanical damage of the module (the module as part of an external application is integrated into a housing). PCS3_HD_v01.
PCS3 Hardware Interface Description 10.2 Mounting Advice Sheet PCS3_HD_v01.
