User's Manual

MC55/56 Hardware Interface Description
Confidential / Preliminary
s
MC55/56_hd_v03.00 Page 19 of 104 16.08.2005
Feature Implementation
External antenna Connected via 50 Ohm antenna connector or antenna pad
Audio interfaces Two analog audio interfaces, one digital audio interface (DAI)
Audio features Speech codec modes:
• Half Rate (ETS 06.20)
• Full Rate (ETS 06.10)
• Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
• Adaptive Multi Rate (AMR)
Handsfree operation
• Echo cancellation
• Noise reduction
Two serial interfaces:
ASC0, ASC1
• 2.65V level, bi-directional bus for AT commands and data
• ASC0 – full-featured 8-wire serial interface. Supports RTS0/CTS0
hardware handshake and software XON/XOFF flow control. Multiplex
ability according to GSM 07.10 Multiplexer Protocol.
• ASC1 - 4-wire serial interface. Supports RTS1/CTS1 hardware
handshake and software XON/XOFF flow control.
• Baud rate: 300bps ... 230kbps on ASC0 and ASC1
• Autobauding (on ASC0 only) detects 1200, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400 bps
Phonebook
management
Supported phonebook types: SM, FD, LD, MC, RC, ON, ME
SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98, support of letter class “c”
Ringing tones Offers a choice of 7 different ringing tones / melodies, easily selectable with
AT command
Real time clock Implemented
Timer function Programmable via AT command
Support of TTY/CTM To benefit from TTY communication via GSM, CTM equipment can be
connected to one of the three audio interfaces.
Physical characteristics Size: 35+0.15 x 32.5+0.15 x 3.1+0.3 mm (including
application connector)
35+0.15 x 32.5+0.15 x 2.95+0.2 mm (excluding
application connector)
Weight: 5.5g
RoHS, WEEE All hardware components are fully compliant with the EU RoHS and WEEE
Directives
Firmware upgrade Firmware upgradable over serial interface and SIM interface
Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type
approve Siemens cellular engines and provide a sample configuration for
application engineering. See Chapter 9 for ordering information.