Integration Manual

HMS1 Hardware Interface Description
Confidential / Preliminary
s
HMS1_HD_V01.62 Page 37 of 39 2006-08-21
7. Board-to-Board Application Connector
This chapter provides specifications and handling instructions for the 80 pin board-to-board
application interface connector used to connect the HMS1 module to the host device.
Table 15: Electrical and mechanical characteristics of the 80 pin board-to-board connector
Parameter Specification (80-way connector)
Number of Contacts 80
Voltage 50V
Current Rating 0.5A max per contact
Resistance 0.05 Ohm per contact
Dielectric Withstanding Voltage 150V RMS AC for 1min
Operating Temperature -40°C...+125°C
Contact Material brass (CuZn)
Insulator Material LCP (= Liquid Crystal Polymer), glass-filled, white
Maximum connection cycles 20 (@ 50mOhm max)
The mechanical dimensions of the 80 pin board-to-board connector are shown below (as an
extract from the datasheet):
Figure 8: Mechanical dimensions of 80 pin board-to-board connector