User's Manual

HC25 Hardware Interface Overview
6.2 Mounting HC25 to the Application Platform
30
s
HC25_HO_v00.220 Page 29 of 39 2007-03-20
Confidential / Preliminary
6.2 Mounting HC25 to the Application Platform
There are many ways to properly install HC25 in the host device. An efficient approach is to
mount the HC25 PCB to a frame, plate, rack or chassis.
Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to
achieve better support. To help you find appropriate spacers a list of selected screws and dis-
tance sleeves for 3mm stacking height can be found in Section 8.2.
When using the holes the screws can be inserted from top or bottom.
For proper grounding it is strongly recommended to use the large ground plane on the bottom
of board in addition to the five GND pins of the board-to-board connector. The ground plane
may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.
Please take care that attached cooling elements do not touch the antenna pads on the mod-
ule’s bottom side, as this may lead a short-circuit.
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is
positioned flat against the host device (see also Section 8.3 with mounting advice sheet).
6.3 Board-to-Board Application Connector
This section provides specifications for the 50-pin board-to-board (B2B) connector used to con-
nect HC25 to the host application.
For the module’s external interface the following connector series has been chosen:
Supplier: Hirose ( www.hirose.com
)
Type: DF12C (3.0)-50DS-0.5V (SlimStack Receptacle)
Height: 3.0 mm
Table 16: Electrical and mechanical characteristics of the board-to-board connector
Parameter Specification (50-way connector)
Number of Contacts 50
Quantity delivered 2000 Connectors per Tape & Reel
Voltage 50V
Current Rating 0.4A max per contact
Resistance 0.05 Ohm per contact
Dielectric Withstanding Voltage 150V RMS AC for 1min
Operating Temperature -40°C...+85°C
Contact Material phosphor bronze finish: solder plating
Insulator Material PPS, deep brown / Polyamide, beige
FFC/FPC Thickness 0.3mm ±0.05mm (0.012" ±0.002")
Maximum connection cycles 20 (@ 50mOhm max)
Cable FFC (Flat Flexible Cable), max. length 150mm from SIM
interface