User's Manual

GWM300 Hardware Interface Overview
2 Product Concept
18
GWM300_HIO_v01 2016-01-26
Confidential / Released
Page 16 of 35
2 Product Concept
2.1 Key Features at a Glance
Feature Implementation
General
Incorporates Cinterion
®
Java module
The Java module handles all signal and data processing within the
GWM300. Internal software runs the application interface and the complete
GSM/UMTS protocol stack.
Frequency bands GWM300 (with EHS6 module):
GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz
UMTS/HSPA+: Five band 800/850/900/1900/2100MHz
GSM class Small MS
Output power (according
to Release 99, V5)
depending on frequency
band supported by mod-
ule
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVI
The values stated above are maximum limits. According to Release 99, the
maximum output power in a multislot configuration may be lower. The nom-
inal reduction of maximum output power varies with the number of uplink
timeslots used and amounts to 3.0dB for 2Tx.
Power supply Single supply voltage 5V to 26V
Operating temperature
(ambient temperature)
Normal operation: -25°C to +70°C
Physical Dimensions: 71mm x 51.5mm x 23.5mm
(excluding antenna and serial interface connectors)
Weight: 60g (approx.)
HSPA features
3GPP Release 6,7 DL 7.2Mbps, UL 5.7Mbps
HSDPA Cat.8 / HSUPA Cat.6 data rates
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL
CS data rate – 64 kbps DL / 64 kbps UL