User's Manual
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 UICC/SIM/USIM Interface
- 2.1.7 Digital Audio Interface
- 2.1.8 Pulse Code Modulation Interface (PCM)
- 2.1.9 Inter IC Sound Interface (I2S)
- 2.1.10 GPIO Interface
- 2.1.11 I2C Interface
- 2.1.12 SPI Interface
- 2.1.13 Pulse Counter
- 2.1.14 HSIC Interface (ELS51-VA Only)
- 2.1.15 SDIO Interface (ELS51-VA Only)
- 2.1.16 Control Signals
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 2.1 Application Interface
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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ELS31-VA/ELS51-VA Hardware Interface Description
4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform
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4.2.4.2 Processing Life
ELS31-VA/ELS51-VA must be soldered to an application within 72 hours after opening the
MBB (=moisture barrier bag) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
4.2.4.3 Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 50 for details):
• It is
not necessary to bake ELS31-VA/ELS51-VA, if the conditions specified in Section
4.2.4.1 and Section 4.2.4.2 were not exceeded.
• It is
necessary to bake ELS31-VA/ELS51-VA, if any condition specified in Section 4.2.4.1
and Section 4.2.4.2 was exceeded.
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
4.2.4.4 Electrostatic Discharge
ESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 3.6 for further information on electrostatic discharge.