User's Manual
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 UICC/SIM/USIM Interface
- 2.1.7 Digital Audio Interface
- 2.1.8 Pulse Code Modulation Interface (PCM)
- 2.1.9 Inter IC Sound Interface (I2S)
- 2.1.10 GPIO Interface
- 2.1.11 I2C Interface
- 2.1.12 SPI Interface
- 2.1.13 Pulse Counter
- 2.1.14 HSIC Interface (ELS51-VA Only)
- 2.1.15 SDIO Interface (ELS51-VA Only)
- 2.1.16 Control Signals
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 2.1 Application Interface
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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ELS31-VA/ELS51-VA Hardware Interface Description
3.6 Electrostatic Discharge
76
ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04
Confidential / Preliminary
Page 72 of 106
3.6 Electrostatic Discharge
The LTE module is not protected against Electrostatic Discharge (ESD) in general. Conse-
quently, it is subject to ESD handling precautions that typically apply to ESD sensitive compo-
nents. Proper ESD handling and packaging procedures must be applied throughout the
processing, handling and operation of any application that incorporates a ELS31-VA/ELS51-VA
module.
Special ESD protection complying to ETSI EN 301 489-01/-07 is provided for the SIM interface
as also mentioned in Section 2.1.6.
The remaining interfaces of ELS31-VA/ELS51-VA with the exception of the antenna interface
are not accessible to the user of the final product (since they are installed within the device)
and are therefore only protected according to the ANSI/ESDA/JEDEC JS-001-2011 require-
ments.
ELS31-VA/ELS51-VA has been tested according to following standards. Electrostatic values
can be gathered from the following table.
Note: The values may vary with the individual application design. For example, it matters
whether or not the application platform is grounded over external devices like a computer or
other equipment, such as the Gemalto reference application described in Chapter 5.3.
3.6.1 ESD Protection for Antenna Interface
The following Figure 38 shows how to implement an external ESD protection for the RF anten-
na interface with either a T pad or PI pad attenuator circuit (for RF line routing design see also
Section 2.2.3).
Figure 38: ESD protection for RF antenna interface
Possible inductors: Murata LQG15HS22NJ02D (22nH), and LQW15AN18NJ00 (18nH)
Table 20: Electrostatic values
Specification/Requirements Contact discharge Air discharge
ETSI EN 301 489-01/-07
SIM interface 4kV 8kV
ANSI/ESDA/JEDEC JS-001-2011
All other SMT interfaces 1kV Human Body Model n.a.
JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 kΩ, 100 pF)
All other SMT interfaces 500VCharge Device Model (CDM) n.a.
Main
Antenna
18pF
22nH
RF_OUT
(Pad 59)
18pF
T pad attenuator circuit
Main
Antenna
18nH
RF_OUT
(Pad 59)
4.7pF
PI pad attenuator circuit
18nH