User's Manual

Cinterion
®
ELS31-/ELS51-US Hardware Interface Overview
1 Introduction
10
ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28
Confidential / Preliminary
Page 7 of 46
1 Introduction
This document
1
describes the hardware of the Cinterion
®
ELS31-US and ELS51-US modules.
It helps you quickly retrieve interface specifications, electrical and mechanical details and in-
formation on the requirements to be considered for integrating further components.
The ELS31-US and ELS51-US modules include a baseband, a complete dual band RF front-
end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re-
lease 10 set of specifications).
The module variants differentiate a follows:
- ELS31-US provides LTE connectivity with IP Services
- ELS51-US adds a Linux execution environment available for customer applications
1.1 Key Features at a Glance
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Gemalto M2M product.
Feature Implementation
General
Frequency bands LTE Triband: B2, B4, B12
Output power Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD B2
Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B12
Power supply 3.3V to 4.5V
Operating temperature
(board temperature)
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Physical Dimensions: 27.60mm x 18.80mm x 2.05mm
Weight: approx. 3g
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 DL 10Mbps, UL 5Mbps
LTE Cat. 1 data rates
SMS Point-to-point MT and MO
Text mode
Storage in mobile equipment
Software
AT commands Hayes, 3GPP TS 27.007, TS 27.005, product specific
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB