User's Manual

Cinterion
®
ALAS6A-US Hardware Interface Overview
1.1 Key Features at a Glance
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 ALAS6A-US_HIO_v00.130a 2016-09-28
Confidential / Preliminary
Page 8 of 40
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna
USB USB 2.0 High Speed (480Mbit/s) device interface or
USB 3.0 Super Speed (5Gbit/s) device interface
UICC interface 2 UICC interfaces (switchable)
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Audio 1 digital interface (PCM)
RING0 Signal line to indicate incoming calls and other types of
URCs
Power on/off, Reset
Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO) or IGT (option)
Automatic switch-off in case of critical temperature or voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency-off Emergency-off by hardware signal EMERG_OFF
Special Features
Antenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx Diversity (receiver type 3i - 64-QAM) / MIMO
GPIO 10 I/O pins of the application interface programmable as GPIO.
Programming is done via AT commands.
ADC inputs Analog-to-Digital Converter with two unbalanced analog inputs for (exter-
nal) antenna diagnosis
Evaluation kit
Evaluation module ALAS6A-US module soldered onto a dedicated PCB that can be con-
nected to the ALAS6A-DSB75 adapter in order to be mounted onto the
DSB75.
ALAS6A-DSB75 adapter A special adapter required to connect the ALAS6A-US evaluation module
to the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering.
Feature Implementation