User's Manual

Cinterion
®
ALAS6A-US Hardware Interface Overview
1 Introduction
9
 ALAS6A-US_HIO_v00.130a 2016-09-28
Confidential / Preliminary
Page 6 of 40
1 Introduction
This document
1
describes the hardware of the Cinterion
®
ALAS6A-US module. It helps you
quickly retrieve interface specifications, electrical and mechanical details and information on
the requirements to be considered for integrating further components.
1.1 Key Features at a Glance
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Gemalto M2M product.
Feature Implementation
General
Frequency bands GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
UMTS/HSPA+: Triple band, 850 (BdV), 1700 (BdIV), 1900 (BdII)
LTE (FDD): Five band, 700 (Bd12 <MFBI Bd17>, Bd29 <supplementary
downlink>), 850 (Bd5), 1700 (Bd4), 1900 (Bd2)
GSM class Small MS
Output power
(according to Release 99)
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIV
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Output power
(according to Release 8)
LTE (FDD):
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>
Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5
Class 3 (+23dBm +-2dB) for LTE 1700, LTE FDD Bd4
Class 3 (+23dBm +-2dB) for LTE1900, LTE FDD Bd2
Power supply 3.3V <
V
BATT+
< 4.2V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Restricted operation: -40°C to +95°C
Physical Dimensions: 40mm x 32mm x 2.8mm
Weight: approx. 6.5g
RoHS All hardware components fully compliant with EU RoHS Directive